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Thermal reliability analysis of key components on PCB based on finite element method

  • 2013-09-19
  • 206.34KB
  • Points it Requires : 1

As electronic devices continue to miniaturize, thermal design becomes increasingly important. Small size and compact layout lead to higher component temperature rise, which greatly reduces the reliability of the system. For this reason, this article starts from the principle of heat transfer and uses ANSYS finite element software to analyze the temperature field distribution of key components on the printed circuit board (PCB) when they are working, and determine the high temperature and low temperature areas of the PCB. The temperature field of PCBs with different layouts is calculated through examples, and a more reasonable layout method is obtained through comparison. Optimize the layout, reduce the maximum temperature of the PCB board, and improve the reliability of the system.

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