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Introduction to electronic component packaging specifications

2013-09-29
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Introduction to the electronic component packaging specifications Introduction to the electronic component packaging specifications Programming/Design 2008-01-10 13:43 Read 94 Comments 1 Font size: Large Medium Medium Small Small package The package is mainly divided into two types: DIP dual in-line package and SMD patch package. In terms of structure, the package has experienced the earliest transistor TO (such as TO-89, TO92) package development to dual in-line package, and then PHILIP company developed SOP small outline package, and then gradually derived SOJ (J-type pin small outline package), TSOP (thin small outline package), VSOP (very small outline package), SSOP (shrink SOP), TSSOP (thin shrink SOP) and SOT (small outline transistor), SOIC (small outline integrated circuit), etc. In terms of material medium, including metal, ceramic, plastic, plastic, many circuits with high-intensity working conditions such as military and aerospace levels still have a large number of metal packages. The development process of packaging is as follows: Structure: TO->DIP->PLCC->QFP->BGA->CSP; Material: metal, ceramic->ceramic, plastic->plastic; Pin shape: long lead straight insertion->short lead or leadless mounting->ball bump; Assembly method: through-hole mounting->surface mounting->direct mounting...

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