Continuously Variable Slope Delta Modulation (CVSD)Codec
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | CML Microcircuits |
Parts packaging code | QLCC |
package instruction | QCCJ, LDCC24,.44SQ |
Contacts | 24 |
Reach Compliance Code | compli |
Law of compression and extension | CVSD |
filter | YES |
JESD-30 code | S-PQCC-J24 |
JESD-609 code | e2 |
length | 10.02 mm |
Number of functions | 1 |
Number of terminals | 24 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC24,.44SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.7 mm |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | CVSD CODEC |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
width | 10.02 mm |
FX609L2 | FX609 | FX609J | FX609LG | FX609P6 | |
---|---|---|---|---|---|
Description | Continuously Variable Slope Delta Modulation (CVSD)Codec | Continuously Variable Slope Delta Modulation (CVSD)Codec | Continuously Variable Slope Delta Modulation (CVSD)Codec | Continuously Variable Slope Delta Modulation (CVSD)Codec | Continuously Variable Slope Delta Modulation (CVSD)Codec |
Maker | CML Microcircuits | - | CML Microcircuits | CML Microcircuits | CML Microcircuits |
Parts packaging code | QLCC | - | DIP | QFP | DIP |
package instruction | QCCJ, LDCC24,.44SQ | - | DIP, DIP22,.4 | QFP, QFP24,.6SQ,50 | DIP, DIP22,.4 |
Contacts | 24 | - | 22 | 24 | 22 |
Reach Compliance Code | compli | - | compli | compli | unknow |
Law of compression and extension | CVSD | - | CVSD | CVSD | CVSD |
filter | YES | - | YES | YES | YES |
JESD-30 code | S-PQCC-J24 | - | R-GDIP-T22 | S-PQFP-G24 | R-PDIP-T22 |
length | 10.02 mm | - | 27.175 mm | 10.085 mm | 27.685 mm |
Number of functions | 1 | - | 1 | 1 | 1 |
Number of terminals | 24 | - | 22 | 24 | 22 |
Operating mode | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | - | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | - | -30 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | - | DIP | QFP | DIP |
Encapsulate equivalent code | LDCC24,.44SQ | - | DIP22,.4 | QFP24,.6SQ,50 | DIP22,.4 |
Package shape | SQUARE | - | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | CHIP CARRIER | - | IN-LINE | FLATPACK | IN-LINE |
power supply | 5 V | - | 5 V | 5 V | 5 V |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.7 mm | - | 5.84 mm | 2.49 mm | 4.95 mm |
Nominal supply voltage | 5 V | - | 5 V | 5 V | 5 V |
surface mount | YES | - | NO | YES | NO |
technology | CMOS | - | CMOS | CMOS | CMOS |
Telecom integrated circuit types | CVSD CODEC | - | CVSD CODEC | CVSD CODEC | CVSD CODEC |
Temperature level | INDUSTRIAL | - | OTHER | INDUSTRIAL | INDUSTRIAL |
Terminal form | J BEND | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
Terminal pitch | 1.27 mm | - | 2.54 mm | 1.27 mm | 2.54 mm |
Terminal location | QUAD | - | DUAL | QUAD | DUAL |
width | 10.02 mm | - | 10.16 mm | 10.085 mm | 10.16 mm |