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FCN-361P048-AU

Description
Bluetooth / 802.15.1 Modules Microchip Technology
CategoryThe connector   
File Size522KB,26 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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FCN-361P048-AU Overview

Bluetooth / 802.15.1 Modules Microchip Technology

FCN-361P048-AU Parametric

Parameter NameAttribute value
Product CategoryBoard to Board & Mezzanine Connectors
ManufacturerFUJITSU
RoHSDetails
Factory Pack Quantity35
FUJITSU TAKAMISAWA
COMPONENT CATALOG
RECTANGULAR CONNECTORS
FCN-360 SERIES
s
FEATURES
• Many applications
Various connectors are available for connection by means
of soldering, wire wrapping, crimping, PC board mounting,
and insulation displacement connection (IDC). The user
can choose a plug and jack combination that best meet
each application.
• Small size for high-density mounting
The connectors are small with a contact and terminal pitch
of 2.54 mm (0.100 in.) between pins and between rows
and are thus well suited for high-density mounting.
• Sturdy shell guide
Sturdy shell guides are used to prevent mismating and to
protect the pins.
• Excellent cost performance
Streamlined design and automated manufacturing,
including use of partial solder plating, provide excellent
cost performance.
s
SPECIFICATIONS
Item
Operating temperature range
Current Rating
Voltage Rating
Contact resistance
Insulation resistance
Dielectric withstanding voltage
Insertion force
Withdrawal force
Soldering
Wire-wrapping
Applicable
wire
–55°C to +85°C
DC 3 A (IDC type: 1 A)
AC 250 V
15 mΩ max. (DC 6 V, 0.3 A)
1000 MΩ min. (DC 500 V)
AC 500 V for 1 minute
2.5 kg max. (8 contacts), 20 kg max. (64 contacts)
0.3 kg min. (8 contacts), 2.3 kg min. (64 contacts)
φ0.60
mm (0.024 in.) max, AWG #23 or less
φ0.32
mm (0.013 in.) to
φ0.26
mm (0.010 in.), AWG #28 to #30
Standard contacts
φ0.51
mm (0.020 in.) to
φ0.32
mm (0.013
in.), AWG #24 to #28, insulator
φ1.2
mm (0.047 in.) max.
Contacts for thick wires
φ0.64
mm (0.025 in.) to
φ0.32
mm
(0.013 in.), AWG #22 to #28, insulator
φ1.7
(0.067 in.) max.
Flat cable 1.27 mm (0.050 in.) pitch, AWG #28 (stranded wire),
AWG #30 (solid wire)
1.6 mm (0.063 in.) standard thick
Specification
s
MATERIALS
Item
Insulator
Conductor
Plating
Material
Polyester (363J: PC94V-2)
Copper alloy
Gold plating, silver plating
Crimping
IDC
Applicable PC board

FCN-361P048-AU Related Products

FCN-361P048-AU FCN-367J040-AU-FW FCN-364P016-AU FCN-363J016 FCN-360C048-B FCN-367J048-AU-F
Description Bluetooth / 802.15.1 Modules Microchip Technology Programmer Accessories USB Program Cable FPGA CPLD u0026 Ser Conf Board to Board u0026 Mezzanine Connectors Board to Board u0026 Mezzanine Connectors Standard Circular Connector STD CABLE CLAMP 11 screw lnth .500 Test Plugs u0026 Test Jacks MINI RIVET BAN PLUG
Product Category Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors Board to Board & Mezzanine Connectors - - Board to Board & Mezzanine Connectors
Manufacturer FUJITSU FUJITSU FUJITSU - - FUJITSU
Factory Pack Quantity 35 160 70 - - 140

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