Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm
2
1 oz. copper bond pad, on a FR4 board)
Symbol
R
θJC
Typ
−
Max
2.2
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
(i
F
= 8 Amps, T
J
= 125°C)
(i
F
= 8 Amps, T
J
= 25°C)
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, T
J
= 125°C)
(Rated dc Voltage, T
J
= 25°C)
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
v
F
0.68
0.81
i
R
180
0.06
300
2
0.76
0.90
mA
V
TYPICAL CHARACTERISTICS
100
i
F
, INSTANTANEOUS FORWARD
CURRENT (A)
100
i
F
, INSTANTANEOUS FORWARD
CURRENT (A)
10
10
T
A
= 175°C
150°C
1
125°C
T
A
= 175°C
1
150°C
125°C
25°C
0
0.2
0.4
−40°C
0.6
0.8
1.0
1.2
0.1
0.1
0
0.2
25°C
0.4
0.6
−40°C
0.8
1.0
1.2
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
I
R
, INSTANTANEOUS REVERSE CURRENT (A)
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
1.E−11
1.E−12
0
10
T
A
= 175°C
T
A
= 150°C
T
A
= 125°C
I
R
, INSTANTANEOUS REVERSE CURRENT (A)
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
1.E−11
0
10
20
30
40
50
60
70
80
90 100
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
T
A
= 25°C
T
A
= −40°C
T
A
= 150°C
T
A
= 125°C
T
A
= 175°C
T
A
= 25°C
T
A
= −40°C
20
30
40
50
60
70
80
90 100
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
www.onsemi.com
2
MBR8H100MFS, NRVB8H100MFS
TYPICAL CHARACTERISTICS
1,000
C, JUNCTION CAPACITANCE (pF)
T
J
= 25°C
I
F(AV)
, AVERAGE FORWARD
CURRENT (A)
20
18
16
14
12
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
90
100
60
80
100
120
140
160
V
R
, REVERSE VOLTAGE (V)
T
C
, CASE TEMPERATURE (°C)
R
qJC
= 2.2°C/W
Square Wave
dc
100
10
Figure 5. Typical Junction Capacitance
8
P
F(AV)
, AVERAGE FORWARD POW-
ER DISSIPATION (W)
I
PK
/I
AV
= 20
7
I
PK
/I
AV
= 10
6
Figure 6. Current Derating
T
J
= 175°C
I
PK
/I
AV
= 5
5
4
3
2
1
0
0
1
2
3
4
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Square Wave
dc
Figure 7. Forward Power Dissipation
100
10
R(t) (°C/W)
50% Duty Cycle
20%
10%
5%
2%
1%
Assumes 25°C ambient and soldered to
a 600 mm
2
− oz copper pad on PCB
1
0.1
Single Pulse
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
PULSE TIME (sec)
Figure 8. Thermal Response
www.onsemi.com
3
MBR8H100MFS, NRVB8H100MFS
PACKAGE DIMENSIONS
DFN6 5x6, 1.27P
(SO8 FL)
CASE 488AA
ISSUE M
0.20 C
D
2
D1
A
B
2X
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.00
5.15
5.30
4.70
4.90
5.10
3.80
4.00
4.20
6.00
6.30
6.15
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.575
0.71
1.20
1.35
1.50
0.51
0.575
0.71
0.125 REF
3.00
3.40
3.80
0
_
−−−
12
_
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
0.20 C
4X
E1
2
E
c
1
2
3
4
q
A1
TOP VIEW
C
0.10 C
A
0.10 C
SIDE VIEW
b
C A B
8X
DETAIL A
SEATING
PLANE
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
RECOMMENDED
SOLDERING FOOTPRINT*
DETAIL A
2X
0.495
2X
4.560
1.530
0.10
0.05
e/2
e
1
4
c
L
3.200
K
4.530
1.330
1
0.965
4X
E2
PIN 5
(EXPOSED PAD)
L1
M
0.905
2X
G
D2
BOTTOM VIEW
1.000
4X
0.750
1.270
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
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