RF Modules RF Receiver 418MHz
Parameter Name | Attribute value |
Brand Name | Freescale |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | SOIC |
package instruction | 1.27 MM PITCH, MS-013AC, SOIC-20 |
Contacts | 20 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Samacsys Description | Microcontrollers |
Has ADC | YES |
Address bus width | |
bit size | 8 |
maximum clock frequency | 16 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | |
JESD-30 code | R-PDSO-G20 |
JESD-609 code | e3 |
length | 12.8 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 18 |
Number of terminals | 20 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP20,.4 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/5 V |
Certification status | Not Qualified |
RAM (bytes) | 256 |
rom(word) | 4096 |
ROM programmability | FLASH |
Maximum seat height | 2.65 mm |
speed | 40 MHz |
Maximum slew rate | 7.7 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 2.7 V |
Nominal supply voltage | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 7.5 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
MC9S08SH4CWJ | MC9S08SH8CWJR | MC9S08SH8MWJR | MC9S08SH8CTJR | MC9S08SH8MTGR | MC9S08SH4CFK | MC9S08SH4CWJR | MC9S08SH8CTG | MC9S08SH4MTJR | |
---|---|---|---|---|---|---|---|---|---|
Description | RF Modules RF Receiver 418MHz | 8-bit Microcontrollers - MCU 9S08 UC W/ 8K 0.25UM SGF | 8-bit Microcontrollers - MCU BL Microcontrollers | Bluetooth / 802.15.1 Modules Class 1 Bluetooth Module w/ Antenna | Development Boards u0026 Kits - S08 / S12 DEMO BRD FOR 9S08SH8 | Development Boards u0026 Kits - S08 / S12 DEMO BRD FOR 9S08SH8 | Development Boards u0026 Kits - S08 / S12 DEMO BRD FOR 9S08SH8 | S08SH 8-BIT MCU, S08 CORE, 4KB F | |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | SOIC | SOIC | SOIC | TSSOP | TSSOP | QFN | SOIC | TSSOP | TSSOP |
package instruction | 1.27 MM PITCH, MS-013AC, SOIC-20 | 1.27 MM PITCH, MS-013AC, SOIC-20 | 1.27 MM PITCH, MS-013AC, SOIC-20 | 0.65 MM PITCH, TSSOP-20 | 0.65 MM PITCH, TSSOP-20 | 4 X 4 MM, 1 MM HEIGHT, MO-220VGGD-6, QFN-24 | 1.27 MM PITCH, MS-013AC, SOIC-20 | TSSOP-16 | 0.65 MM PITCH, TSSOP-20 |
Contacts | 20 | 20 | 20 | 20 | 16 | 24 | 20 | 16 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 code | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G16 | S-PQCC-N24 | R-PDSO-G20 | R-PDSO-G16 | R-PDSO-G20 |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Number of terminals | 20 | 20 | 20 | 20 | 16 | 24 | 20 | 16 | 20 |
Maximum operating temperature | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | SOP | TSSOP | TSSOP | HVQCCN | SOP | TSSOP | TSSOP |
Encapsulate equivalent code | SOP20,.4 | SOP20,.4 | SOP20,.4 | TSSOP20,.25 | TSSOP16,.25 | LCC24,.16SQ,20 | SOP20,.4 | TSSOP16,.25 | TSSOP20,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
power supply | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 256 | 512 | 512 | 512 | 512 | 256 | 256 | 512 | 256 |
rom(word) | 4096 | 8192 | 8192 | 8192 | 8192 | 4096 | 4096 | 8192 | 4096 |
ROM programmability | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.5 mm | 1.27 mm | 0.65 mm | 0.635 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Brand Name | Freescale | Freescale | Freescale | Freescale | Freescale | Freescale | - | Freescale | - |
Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | - |
Maker | NXP | NXP | NXP | NXP | NXP | - | NXP | NXP | NXP |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
Has ADC | YES | YES | YES | YES | YES | YES | YES | YES | - |
maximum clock frequency | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 40 MHz | - |
DAC channel | NO | NO | NO | NO | NO | NO | NO | NO | - |
DMA channel | NO | NO | NO | NO | NO | NO | NO | NO | - |
JESD-609 code | e3 | e3 | e3 | e3 | e3 | - | e3 | e3 | e3 |
length | 12.8 mm | 12.8 mm | 12.8 mm | 6.5 mm | 5 mm | 4 mm | 12.8 mm | 5 mm | - |
Number of I/O lines | 18 | 18 | 18 | 18 | 14 | 18 | 18 | 17 | - |
PWM channel | YES | YES | YES | YES | YES | YES | YES | YES | - |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | - |
Maximum seat height | 2.65 mm | 2.65 mm | 2.65 mm | 1.2 mm | 1.2 mm | 1 mm | 2.65 mm | 1.2 mm | - |
Maximum slew rate | 7.7 mA | 7.7 mA | 7.7 mA | 7.7 mA | 7.7 mA | - | 7.7 mA | - | 7.7 mA |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
Minimum supply voltage | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | - |
Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - | - |
Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | - |
width | 7.5 mm | 7.5 mm | 7.5 mm | 4.4 mm | 4.4 mm | 4 mm | 7.5 mm | 4.4 mm | - |