BGA2714
MMIC wideband amplifier
Rev. 01 — 24 May 2007
Product data sheet
1. Product profile
1.1 General description
Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal
matching circuit in a 6-pin SOT363 plastic SMD package.
Table 1.
Typical performance
T
amb
= 25
°
C; measured on demo board; typical values.
f
(MHz)
250
950
2150
V
SUP
(V)
3.0
3.0
3.0
I
SUP
(mA)
4.58
4.58
4.58
G
p
(dB)
20.7
20.4
20.8
NF
(dB)
2.4
2.2
3.0
P
L(1dB)
(dBm)
−7.8
−7.9
−9.0
P
L(sat)
(dBm)
−2.4
−3.4
−4.7
IP3
O
(dBm)
4.3
2.1
0.0
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
I
I
I
I
I
I
I
I
Internally matched to 50
Ω
Wide frequency range (2.7 GHz at 3 dB gain bandwidth)
Flat 21 dB gain (± 1 dB from DC up to 2500 MHz)
Very low current (4.6 mA) at low supply voltage of 3 V
Very good reverse isolation (> 50 dB up to 2 GHz)
Good linearity with low second order and third order products
Low noise (NF = 2.2 dB at 1 GHz)
Unconditionally stable (K > 5)
1.3 Applications
I
LNB IF amplifiers
I
General purpose low noise wideband amplifier for frequencies between
DC and 2.7 GHz
NXP Semiconductors
BGA2714
MMIC wideband amplifier
2. Pinning information
Table 2.
Pin
1
2, 5
3
4
6
Pinning
Description
V
SUP
GND2
RF_OUT
GND1
RF_IN
1
2
3
6
5
4
6
4
2, 5
sym052
Simplified outline
Symbol
1
3
3. Ordering information
Table 3.
Ordering information
Package
Name
BGA2714
-
Description
plastic surface-mounted package; 6 leads
Version
SOT363
Type number
4. Marking
Table 4.
BGA2714
Marking
Marking code
BA-
Type number
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
SUP
I
SUP
P
tot
T
stg
T
j
P
drive
Parameter
supply voltage
supply current
total power dissipation
storage temperature
junction temperature
drive power
T
sp
= 90
°C
Conditions
RF input AC coupled
Min
-
-
-
−65
-
-
Max
4
10
200
+150
150
−20
Unit
V
mA
mW
°C
°C
dBm
BGA2714_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 24 May 2007
2 of 15
NXP Semiconductors
BGA2714
MMIC wideband amplifier
6. Thermal characteristics
Table 6.
Symbol
R
th(j-sp)
Thermal characteristics
Parameter
Conditions
Typ
300
Unit
K/W
thermal resistance from junction to P
tot
= 200 mW; T
sp
= 90
°C
solder point
7. Characteristics
Table 7.
Characteristics
V
SUP
= 3 V; I
SUP
= 4.58 mA; T
amb
= 25
°
C; measured on demo board; unless otherwise specified.
Symbol Parameter
I
SUP
G
p
supply current
power gain
f = 100 MHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
f = 2500 MHz
f = 3000 MHz
RL
in
input return loss
f = 250 MHz
f = 950 MHz
f = 2150 MHz
RL
out
output return loss
f = 250 MHz
f = 950 MHz
f = 2150 MHz
ISL
isolation
f = 250 MHz
f = 950 MHz
f = 2150 MHz
NF
noise figure
f = 250 MHz
f = 950 MHz
f = 2150 MHz
B
−3dB
K
−3
dB bandwidth
Rollet stability factor
3 dB below gain
at 1 GHz
f = 250 MHz
f = 950 MHz
f = 2150 MHz
P
L(sat)
saturated output power
f = 250 MHz
f = 950 MHz
f = 2150 MHz
P
L(1dB)
output power at 1 dB gain compression f = 250 MHz
f = 950 MHz
f = 2150 MHz
Conditions
Min
3.7
20
20
20
20
19
16
11
7
12
10
10
8
55
55
45
-
-
-
-
25
35
7
−3
−4
−6
−8.5
−8.7
−10
Typ
4.58
20.8
20.7
20.4
20.8
19.5
16.8
13.9
8.9
15.9
10.6
10.8
9.8
58
59
49
2.4
2.2
3.0
2.7
30
47
10
−2.4
−3.4
−4.7
−7.8
−7.9
−9
Max Unit
5.7
21
21
21
22
21
18
-
-
-
-
-
-
-
-
-
2.5
2.3
3.2
-
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
mA
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
GHz
BGA2714_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 24 May 2007
3 of 15
NXP Semiconductors
BGA2714
MMIC wideband amplifier
Table 7.
Characteristics
…continued
V
SUP
= 3 V; I
SUP
= 4.58 mA; T
amb
= 25
°
C; measured on demo board; unless otherwise specified.
Symbol Parameter
IP3
I
input third-order intercept point
Conditions
f = 250 MHz
f = 950 MHz
f = 2150 MHz
IP3
O
output third-order intercept point
f = 250 MHz
f = 950 MHz
f = 2150 MHz
P
L(2H)
second harmonic output power
f
1H
= 250 MHz;
f
2H
= 500 MHz;
P
drive
=
−40
dBm
f
1H
= 950 MHz;
f
2H
= 1900 MHz;
P
drive
=
−40
dBm
∆IM2
second-order intermodulation distance
f
1
= 250 MHz;
f
2
= 251 MHz;
P
drive
=
−40
dBm
f
1
= 950 MHz;
f
2
= 951 MHz;
P
drive
=
−40
dBm
Min
Typ
Max Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
−17.4 −16.4
-
−19.1 −18.3
-
−21.8 −20.8
-
3.3
1.3
−1.0
−62
4.3
2.1
0
−64
-
-
-
-
−58
−60
-
dBm
−36
−38
-
dBc
−31
−33
-
dBc
8. Application information
Figure 1
shows a typical application circuit for the BGA2714 MMIC. The device is
internally matched to 50
Ω,
and therefore does not need any external matching. The value
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF
for applications above 100 MHz. However, when the device is operated below 100 MHz,
the capacitor value should be increased.
The 22 nF supply decoupling capacitor C1 should be located as close as possible to the
MMIC.
The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to
the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes
as close as possible to the MMIC.
V
S
C1
V
S
RF_IN
RF_OUT
C3
C2
RF input
RF output
GND1
GND2
001aaf761
Fig 1. Typical application circuit
BGA2714_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 24 May 2007
4 of 15
NXP Semiconductors
BGA2714
MMIC wideband amplifier
8.1 Application examples
wideband
amplifier
to IF circuit
or demodulator
antenna
wideband
amplifier
mixer
from RF
circuit
LNA
mixer
to IF circuit
or demodulator
oscillator
oscillator
001aaf762
001aaf763
The MMIC is very suitable as IF amplifier in e.g.
LNB’s. The excellent wideband characteristics make
it an easy building block.
As second amplifier after an LNA, the MMIC offers
an easy matching, low noise solution.
Fig 2. Application as IF amplifier
Fig 3. Application as RF amplifier
8.2 Graphs
90°
+1
135°
+0.5
+2
45°
1.0
0.8
0.6
0.4
0.2
5
10
0°
0
+0.2
100 MHz
2
+5
180°
0
0.2
0.5
3 GHz
1
−0.2
−5
−135°
−0.5
−1
−90°
−2
−45°
1.0
001aaf764
T
amb
= 25
°C;
I
SUP
= 4.58 mA; V
SUP
= 3 V; P
drive
=
−40
dBm; Z
0
= 50
Ω.
Fig 4. Input reflection coefficient (S
11
); typical values
BGA2714_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 24 May 2007
5 of 15
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