data sheet
Features:
LEADFRAME
LQFP
PowerQuad
®
4
High-performance operation and attributes of the LQFP
PowerQuad
®
4 include the following:
• High conductive, solid exposed heatsink
• 1.4 mm body for lightweight, portable applications
• 50% reduction in package self-inductance
• 50% improvement in
θJa
over standard MQFP
• 44 to 128 lead counts
• 10 x 10 - 14 x 14 mm body sizes
(JEDEC standard packages MS-026)
• Heatsink-up and down configurations available
LQFP PowerQuad
®
4
Packages:
LQFP PowerQuad
®
4 (PQ4) is the same Amkor
patented, advanced IC packaging technology used
in MQFP PQ4s but applied to Low Profile 1.4 mm
QFPs (LQFP). Improved power dissipation is
achieved by using an exposed copper heatslug. This
large copper heat slug extracts generated heat from
the leadframe to which the IC is attached. Thermal
resistance improvements of approximately 30%
(over a standard LQFP) can be realized with this IC
package without the use of any external cooling
aids! In addition, the patented LQFP PQ4 heatsink
has integrated mechanical “locking” features to
ensure total package integrity and eliminates mois-
ture penetration. The end result is a high-power,
high-speed IC package with the properties to enable
new, smaller, denser, portable electronic products
and emerging end applications to operate with
more features and greater reliability.
Applications:
Major semiconductor manufacturers and packaging
engineers have chosen LQFP PQ4 as the IC package of
choice for power microprocessors, controllers, DSPs, high
speed logic/FPGAs, PLDs, ASICs and other advanced
technologies. System designers and OEM product
developers find the LQFP PQ4 solves power, thermal
and speed concerns while supporting system constraints
(standard package outlines, cost, SMT capability,
product availability, technical support) in uses such as:
laptops, notebooks, telecom, cordless/wireless, high-
end audio/video, CPU/GUI board systems and many
other small form-factor applications.
Thermal Resistance:
Multi-Layer PCB
Theta JA (°C/W) by Velocity (LFPM)
Pkg Body Size Pad Size
64 ld 10 x 10
7.5
100 Id 14 x 14
9.5
Pre-JEDEC Standard Test Boards
0
34.8
23.2
200
28.9
12.8
500
26.4
15.8
Reliability:
Advanced design, manufacturing processes and materials
assure long-term reliable performance.
• Temp cycle
• Thermal shock (liq)
• Autoclave
• Temp/Humidity
• High temp storage
-65/+150 °C, 1000 cycles
-65/+150 °C, 1000 cycles
121 °C, 2 atm, 168 hours
85 °C/85%RH, 1000 hours
150 °C, 1000 hours
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS576B
Rev Date: 05‘06
data sheet
Cross-sections
LQFP PowerQuad
®
4
LEADFRAME
LQFP
PowerQuad
®
4
Process Highlights
Die thickness (max)
15.0 mils
Strip solder plating
85/15 Sn/Pb
Strip marking
Pad
Lead inspection
Laser/optical
Pack/ship options
Bar code/dry pack/TNR
Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
• 256 Pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in
Shipping
Low profile tray (JEDEC Outline CS-007)
Inverted
Configuration Options:
LOW PROFILE POWERQUAD
®
4 PACKAGE FAMILY (units in mm)
Lead
Count
44
44
64
64
80
100
120
128
Body
Size
10 x 10
14 x 14
10 x 10
14 x 14
14 x 14
14 x 14
14 x 14
14 x 14
Body
Thickness
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
Lead
Pitch
0.80
1.0
0.50
0.80
0.65
0.50
0.40
0.40
Form
Length
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Tip
To Tip
12.0 x 12.0
16.0 x 16.0
12.0 x 12.0
16.0 x 16.0
16.0 x 16.0
16.0 x 16.0
16.0 x 16.0
16.0 x 16.0
Foot
Length
0.60
0.60
0.60
0.60
0.60
0.60
0.60
0.60
Board
JEDEC
Standoff Package
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
MS-026
MS-026
MS-026
MS-026
MS-026
MS-026
MS-026
MS-026
Tray
Matrix
8 x 20
6 x 15
8 x 20
6 x 15
6 x 15
6 x 15
6 x 15
6 x 15
Units
Per Tray
240
90
240
90
90
90
90
90
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
Analog electronics
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