U637H256DK25G1 datasheet, PDF - EEWORLD Datasheet

U637H256DK25G1: Descriptioncapstore 32k x 8 nvsram; Categorystorage storage; File Size145KB，14 Pages; ManufacturerSimtek; Websitehttp://www.simtek.com; Environmental Compliance

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U637H256DK25G1 Overview

capstore 32k x 8 nvsram

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Simtek
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	25 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e3
length	36.83 mm
memory density	262144 bit
Memory IC Type	NON-VOLATILE SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum standby current	0.003 A
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

	U637H256DK25G1	U637H256DC25G1
Description	capstore 32k x 8 nvsram	capstore 32k x 8 nvsram
Is it Rohs certified?	conform to	conform to
Maker	Simtek	Simtek
package instruction	DIP, DIP28,.6	DIP, DIP28,.6
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	25 ns	25 ns
JESD-30 code	R-PDIP-T28	R-PDIP-T28
JESD-609 code	e3	e3
length	36.83 mm	36.83 mm
memory density	262144 bit	262144 bit
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	8	8
Number of functions	1	1
Number of terminals	28	28
word count	32768 words	32768 words
character code	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C
organize	32KX8	32KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm
Maximum standby current	0.003 A	0.003 A
Maximum slew rate	0.1 mA	0.095 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
width	15.24 mm	15.24 mm

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