|
TLC1542IDWG4 |
TLC1543CNE4 |
TLC1543CFNG3 |
TLC1542CDWRG4 |
TLC1542CFNG3 |
Description |
Analog to Digital Converters - ADC 10Bit 38kSPS SerOut On-Chip Sys Clk 11Ch |
Analog to Digital Converters - ADC 10Bit 38kSPS SerOut On-Chip Sys Clk 11Ch |
Analog to Digital Converters - ADC 10Bit 38kSPS SerOut On-Chip Sys Clk 11Ch |
Analog to Digital Converters - ADC 10Bit 38kSPS SerOut On-Chip Sys Clk 11Ch |
Analog to Digital Converters - ADC 10Bit 38kSPS SerOut On-Chip Sys Clk 11Ch |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
SOIC |
DIP |
QLCC |
SOIC |
QLCC |
package instruction |
SOP, SOP20,.4 |
DIP, DIP20,.3 |
QCCJ, LDCC20,.4SQ |
SOP, SOP20,.4 |
QCCJ, LDCC20,.4SQ |
Contacts |
20 |
20 |
20 |
20 |
20 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum analog input voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Maximum conversion time |
21 µs |
21 µs |
21 µs |
21 µs |
21 µs |
Converter type |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
ADC, SUCCESSIVE APPROXIMATION |
JESD-30 code |
R-PDSO-G20 |
R-PDIP-T20 |
S-PQCC-J20 |
R-PDSO-G20 |
S-PQCC-J20 |
JESD-609 code |
e4 |
e4 |
e3 |
e4 |
e3 |
length |
12.8 mm |
25.4 mm |
8.965 mm |
12.8 mm |
8.965 mm |
Maximum linear error (EL) |
0.0488% |
0.0977% |
0.0977% |
0.0488% |
0.0488% |
Number of analog input channels |
11 |
11 |
11 |
11 |
11 |
Number of digits |
10 |
10 |
10 |
10 |
10 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
20 |
20 |
20 |
20 |
20 |
Maximum operating temperature |
85 °C |
70 °C |
70 °C |
70 °C |
70 °C |
Output bit code |
BINARY |
BINARY |
BINARY |
BINARY |
BINARY |
Output format |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
DIP |
QCCJ |
SOP |
QCCJ |
Encapsulate equivalent code |
SOP20,.4 |
DIP20,.3 |
LDCC20,.4SQ |
SOP20,.4 |
LDCC20,.4SQ |
Package shape |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
SQUARE |
Package form |
SMALL OUTLINE |
IN-LINE |
CHIP CARRIER |
SMALL OUTLINE |
CHIP CARRIER |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
260 |
260 |
260 |
power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Sample and hold/Track and hold |
SAMPLE |
SAMPLE |
SAMPLE |
SAMPLE |
SAMPLE |
Maximum seat height |
2.65 mm |
5.08 mm |
4.57 mm |
2.65 mm |
4.57 mm |
Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
NO |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Matte Tin (Sn) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Matte Tin (Sn) |
Terminal form |
GULL WING |
THROUGH-HOLE |
J BEND |
GULL WING |
J BEND |
Terminal pitch |
1.27 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
QUAD |
DUAL |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
7.5 mm |
7.62 mm |
8.965 mm |
7.5 mm |
8.965 mm |
Humidity sensitivity level |
1 |
- |
1 |
1 |
1 |