Junction Temperature ..................................................................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (T
A
=25°C) ............................................................................................................................. 0.6 W
(Note1)
Total Power Dissipation (T
A
=25°C) ................................................................................................................................ 2 W
(Note2)
Total Power Dissipation (T
C
=25°C) ............................................................................................................................. 1.3 W
(Note1)
Total Power Dissipation (T
C
=25°C) ............................................................................................................................. 3.4 W
(Note2)
•
Maximum Voltages and Currents (T
A
=25°C)
V
CBO
Collector to Base Voltage .............................................................................................................................................. 70 V
V
CEO
Collector to Emitter Voltage........................................................................................................................................... 30 V
V
EBO
Emitter to Base Voltage ................................................................................................................................................... 5 V
I
C
Collector Current.................................................................................................................................................................. 3 A
Thermal Characteristic
Characteristic
Thermal Resistance, junction to ambient
(Note1)
Thermal Resistance, junction to ambient
(Note2)
Thermal Resistance, junction to case
Thermal Resistance, junction to case
(Note1)
(Note2)
Symbol
R
θja
R
θja
R
θjc
R
θjc
Max.
208
62.5
86
36.8
Unit
o
o
o
o
C/W
C/W
C/W
C/W
Note1: When tested in free air condition, without heat sinking.
Note2: When mounted on a 40X40X1mm ceramic board.
Electrical Characteristics
(T =25°C)
A
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
EBO
*V
CE(sat)
*V
BE(sat)
*h
FE1
*h
FE2
f
T
Cob
Min.
40
30
5
-
-
-
-
30
160
-
-
Typ.
-
-
-
-
-
-
-
-
-
90
45
Max.
-
-
-
1
1
0.5
2
-
500
-
-
Unit
V
V
V
uA
uA
V
V
Test Conditions
I
C
=100uA, I
E
=0
I
C
=1mA, I
B
=0
I
E
=10uA, I
C
=0
V
CB
=30V, I
E
=0
V
EB
=3V, I
B
=0
I
C
=2A, I
B
=0.2A
I
C
=2A, I
B
=0.2A
V
CE
=2V, I
C
=20mA
V
CE
=2V, I
C
=1A
V
CE
=5V, I
C
=0.1A, f=100MHz
I
E
=0,V
CB
=10V, f=1MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
MHz
pF
Classification Of hFE2
Rank
Range
P
160-320
E
250-500
HM882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
Spec. No. : HE9514
Issued Date : 1997.06.05
Revised Date : 2006.07.27
Page No. : 2/4
Saturation Voltage & Collector Current
10
Saturation Voltage (V)
1
V
BE(sat)
@ I
C
=10I
B
hFE
V
CE
=2V
0.1
V
CE(s at)
@ I
C
=10I
B
100
0.01
0.1
1
10
100
1000
10000
0.01
0.1
1
10
100
1000
10000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100
1000
Cutoff Frequency & Collector Current
Cob
Cutoff Frequency (MHz)
Capacitance (pF)
V
CE
=5V
10
0.1
1
10
100
100
1
10
100
1000
Reverse-Biased Voltage (V)
Collector Current (mA)
Safe Operating Area
10000
P
T
=1ms
Collector Current-I
C
(mA)
1000
P
T
=100ms
P
T
=1s
100
10
1
10
100
Forward Voltage-V
CE
(V)
HM882
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
C
Marking:
Spec. No. : HE9514
Issued Date : 1997.06.05
Revised Date : 2006.07.27
Page No. : 3/4
H
Date Code
H 8 8 2
Control Code
Pb Free Mark
Pb-Free: " "
(Note)
Normal: None
B
1
E
F
G
A
2
3
D
Note: Green label is used for pb-free packing
J
I
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
Min.
4.40
4.05
1.50
2.40
0.36
*1.50
*3.00
1.40
0.35
Max.
4.60
4.25
1.70
2.60
0.51
-
-
1.60
0.41
*: Typical, Unit: mm
3-Lead SOT-89 Plastic
Surface Mounted Package
HSMC Package Code: M
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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