Standard SRAM, 128KX18, 10ns, CMOS, PQFP100, 14 X 20 MM, LEAD FREE, TQFP-100
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Integrated Silicon Solution ( ISSI ) |
Parts packaging code | QFP |
package instruction | LQFP, |
Contacts | 100 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 10 ns |
Other features | FLOW-THROUGH ARCHITECTURE |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e3 |
length | 20 mm |
memory density | 2359296 bit |
Memory IC Type | STANDARD SRAM |
memory width | 18 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 131072 words |
character code | 128000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128KX18 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 245 |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 14 mm |
Base Number Matches | 1 |