Metal Film Thermosensitive Chip Resistors
Metal Film Thermosensitive Chip Resistors
0402, 0603, 0805
Type:
ERAW, V, S
■
Features
●
Suitable for temperature correction circuits
–6
–6
●
Temperature coefficient value 1500 10 /°C(ppm/°C) to 3900 10 /°C(ppm/°C)
●
High performance
Quick response to temperature change
●
Linearity
Excellent linear resistance value change in wide temperature range (–40 °C to +125 °C)
●
High reliability, High density placing
●
Small size and lightweight for PCB size reduction and lightweight products
●
Suitable for both reflow and flow soldering
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
R
A
S
1
5
J
1
0
3
V
Product Code
Metal Film
Chip Resistors
Size, Power Rating
Type: inches Power Rating
W : 0402
0.031 W
V : 0603
0.063 W
S : 0805
0.1 W
Resistance Tolerance
Code
J
Tol.
±
5%
Code
X
V
Resistance Value
Packaging Methods
Packaging
Type
Punched Carrier Taping
ERAW
2 mm pitch
Punched Carrier Taping ERAV
4 mm pitch
ERAS
Temperature Coefficient of Resistance (TCR)
Code
Type
( 10
–6
/°C)
15
ERAV, ERAS
1500
27
ERAW, ERAV, ERAS
2700
33
ERAW, ERAV, ERAS
3300
39
ERAV, ERAS
3900
The first two digits are significant figures of
resistance and the third one denotes number of
zeros following. Decimal point is expressed by “R ”.
(ex.) 103 : 10 k
6R8 : 6.8
■
Construction
Protective coating
Electrode (Inner)
■
Dimensions in mm (not to scale)
L
a
W
Alumina substrate
(1)
t
b
Electrode
(Between)
Type
(inches)
ERAW
(0402)
ERAV
(0603)
Thermosensitive
element
ERAS
(0805)
Electrode (Outer)
Dimensions (mm)
L
1.00
1.60
2.00
±0.07
W
0.50
0.80
1.25
±0.05
a
0.15
±0.10
b
0.25
0.30
0.40
±0.07
t
0.35
0.45
0.50
±0.05
Mass (Weight)
[g/1000 pcs.]
0.6
2
4
±0.20
±0.20
0.30
0.40
±0.20
±0.20
±0.10
±0.20
±0.10
±0.25
±0.25
±0.10
1) Marking Temperture Coefficient value :
–6
2 significant figure 100 10 /°C (ppm/°C)
ERAW type is no marking.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jan. 2008
Metal Film Thermosensitive Chip Resistors
■
Ratings
Type
(inched)
Power Rating
at 70 °C
(W)
Standard Specification
T.C.R.
(2)
[ 10 /°C(ppm/°C)]
–6
(1)
Resistance
Range ( )
43 to 1 k
22 to 390
10 to 10 k
43 to 3.3 k
22 to 1.2 k
7.5 to 390
10 to 10 k
43 to 5.1 k
22 to 1.8 k
6.2 to 470
T.C.R.
Tolerance
Resistance
Tolerance
(%)
Standard
Resistance
Values
ERAW
(0402)
0.031
2700
3300
1500
2700
3300
3900
1500
2700
3300
3900
±10 %
±200[ 10
-6
/°C(ppm/°C)]
±10 %
±200[ 10
-6
/°C(ppm/°C)]
±10 %
±5
E12
ERAV
(0603)
0.063
±5
E12
ERAS
(0805)
0.1
±5
E12
(1) Please ask us when resistors other than standard specification shown in the above table are needed.
(2) T.C.R.=
{
R R-R
75
25
25
1
75–25
10
6
}
10 / ° C (ppm/ ° C)
–6
R
25
: Resistance value at reference temperature 25 °C
R
75
: Resistance value at temperature 75 °C
Rated Load (%)
Power Derating Curve
For resistors operated in ambient
tem per a tures above 70 °C, power rating
shall be derated in accordance with the
figure on the right.
Category Temperature Range
(Operating Temperature Range)
–40 °C to +125 °C
120
100
80
60
40
20
0
–40
–20
0
20
40
60
70
°C
125
°C
80
100
120
140
Ambient Temperature(°C)
■
Typical Linearity of Resistance Change
60
Resistance Change (%)
50
40
30
20
10
0
–10
–20
–30
–40
–25
0
25
50
75
100
125
3900 10
–6
/°C (ppm/°C)
2700 10
–6
/°C (ppm/°C)
1500 10
–6
/°C (ppm/°C)
Ambient Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Metal Film Thermosensitive Chip Resistors
■
Packaging Methods (Taping)
●
Standard Quantity
Type
ERAW
ERAV
ERAS
●
Carrier Tape
Punched Carrier
φD
0
P
1
P
2
P
0
E
Kind of Taping
Punched Carrier Taping
Pitch (P
1
)
2 mm
4 mm
Quantity
10000 pcs./reel
5000 pcs./reel
(Unit : mm)
F
B
T
A
P
1
(2 mm pitch)
W
Type
ERAW
ERAV
ERAS
A
0.70
±0.05
B
1.20
±0.05
W
8.00
±0.20
F
3.50
±0.05
E
1.75
±0.10
P
1
2.00
4.00
±0.10
P
2
2.00
±0.05
P
0
4.00
±0.10
φD
0
1.50
+0.10
–0
T
0.52
±0.05
0.70
±0.05
0.52
±0.05
(Unit : mm)
1.10
±0.10
1.65
±0.15
1.90
±0.10
2.50
±0.20
±0.10
●
Taping Reel
T
φC
φB
Type
ERAW
ERAV
ERAS
φA
φB
φC
W
9.0
±1.0
T
11.4
±1.0
180.0
+0
60 min. 13.0
±1.0
–3.0
φA
W
■
Attention
This product has high temperature coefficient. When measuring resistance, the resistance value can change due
to Joule Heating. Therefore, the measuring current shall be very small in order to prevent the resistance value from
changing. (For example, when the resistor is used at RCWV, temperature of the resistor rise about 15 °C and the
resistance value rise a few percents.) Resistance value may also change due to the ambient temperature. Resistance
value is measured at 25 °C.
■
Recommended Land Pattern
In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the solder
amount properly. Generally, the land width should be 0.7 to 0.8 times of the width of chip resistor. In case of
reflow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times of chip
resistor width (W).
Example
Chip Resistor
Type
(inches)
ERAW
(0402)
ERAV
(0603)
ERAS
(0805)
Dimensions (mm)
a
0.5 to 0.6
0.7 to 0.9
1 to 1.4
b
1.4 to 1.6
2 to 2.2
3.2 to 3.8
c
0.4 to 0.6
0.8 to 1
0.9 to 1.4
a
b
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
c
Feb. 2006
Metal Film Thermosensitive Chip Resistors
■
Recommended Soldering Conditions
Recommendations and precautions are described below.
●
Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Peak
Temperature
Preheating
Heating
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
●
Recommended soldering conditions for flow
For soldering
Temperature
Time
140 °C to 180 °C
60 s to 120 s
245 ± 5 °C
20 s to 30 s
For lead-free soldering
Temperature
Time
150 °C to 180 °C
60 s to 120 s
max. 260 °C
max. 10 s
Preheating
Soldering
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Keep the rated power and ambient temperature within the specified derating curve.
* When positioning and mounting Metal Film Thermosensitive Chip Resistors (hereafter called the resistors), make
allowance for the effect of heat generated through close contact between the resistors and neighboring components
and for the temperature rise of adjacent heat-generating components.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
When applying pulses to the resistors, keep the pulse peak within the rated voltage.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be
impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during
handling of the boards with the resistors mounted.
7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
½
Systems equipped with a protection circuit and a protection device
½
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap plianc es, offi ce equipment, information and com mu ni cation
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
inflammables, such as vinyl-coated wires, near these products .
• Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl
2
, H
2
S, NH
3
, SO
2
, or NO
2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
– ER3 –
PCB Design
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