Indicates performance and reliability requirements. "B" level represents standard reliability."T" level represents high reliability.
Please refer to performance specification sheet MIL-PRF-49470 for details regarding test levels. The latest revision of the specification sheet is available through DSCC.
1, 3
Test level option "T" is not available on encapsulated stacked devices (i.e. MIL-PRF-49470/2).
2
Dielectric classification and characteristic details are outlined in the "Electrical Parameters" section of this document.
4
Lead configuration and dimension details are outlined in the "Dimensions" section of this document.
1
1
KPS MIL Series, SMPS Stacks Ordering Information
(Do not use this ordering code if a QPL MIL-SPEC part type is required. Please order using MIL-SPEC ordering code. Details
regarding MIL-PRF-49470 QPL ordering information is outlined above.)
L1
1
R
N
30
C
106
K
S
Testing Option
4
12
Maximum Height
Dimension (in.)
5
Dielectric
Lead
Product Family Classification/
Configuration
3
Characteristic
2
L1 =
Unencapsulated
L2 =
Encapsulated
Q = BQ
R = BR
X = BX
W = X7R
N = Straight
L = Formed "L"
M= Formed "L"
J= Formed "J"
K= Formed "J"
Case Size /
Rated
Capacitance Capacitance
Case Code
Voltage (DC) Code (pF)
Tolerance
(CC)
30 = CC 3
40 = CC 4
50 = CC 5
3 = 25V 2 Sig. Digits J = ±5%
5 = 50V + Number of K = ±10%
1 = 100V
Zeros
M = ±20%
2 = 200V
C = 500V
B = 630V
D = 1000V
B = M49470 "B" Level Unencapsulated Encapsulated
T = M49470 "T" Level
12 = 0.12"
27 = 0.27"
C = DSCC87106
24 = 0.24"
39 = 0.39"
S = Commercial
36 = 0.36"
53 = 0.53"
X = Non-Standard
48 = 0.48"
66 = 0.66"
(Customer Specific
65 = 0.65"
80 = 0.80"
Requirements)
,
Test level option "T" is not available on encapsulated stacked devices, i.e., MIL-PRF-49470/2. If a QPL MIL-Spec part type is required, please order using the
MIL-Spec ordering code.
2
Dielectric classification and characteristic details are outlined in the ""Electrical Parameters"" section of this document.
3
Lead configuration and dimension details are outlined in the "Dimensions" section of this document. Additional lead configurations may be available. Contact
KEMET for details.
4
Indicates performance and reliability requirements. Testing option details are outlined in the "Performance and Reliability" section of this document.
4
Please refer to performance specification sheet MIL-PRF-49470 for additional details regarding test levels. The latest revision of the specification sheet is
available through DSCC.
4
DSCC Drawing 87106 was cancelled on 01/03/2005. MIL-PRF-49470 capacitors are preferred over DSCC Drawing 87106 capacitors.
5
Maximum height dimensions are provided in product tables 1A, 1B, and 1C of this document
1
4
Ordering Information Requirements per DSCC Drawing 87106
DSCC Drawing 87106 was cancelled on 01/03/2005. Customers can continue to order per 87106 requirements using the original DSCC ordering code,i.e., 87106-001.
When available, MIL-PRF-49470 devices are preferred over DSCC Drawing 87106. The MIL-PRF-49470 military specification product provides additional quality
assurance provisions that are not required by the DSCC drawing. These extra provisions create a more robust replacement.
1. Unless otherwise specified, tolerances are ±.010" (0.25mm).
2. Metric equivalents for C, D and E dimensions are provided for general information only.
3. For maximum B dimension, add .065" (1.65mm) to the appropriate A dimension. For all lead styles, the number of chips is determined by the capacitance and
voltage rating.
4. For case code 5, dimensions shall be .100" (2.54mm) maximum and .012” (0.30mm) minimum.
5. Lead alignment within pin rows shall be within ±.005" (0.13mm).
Unencapsulated & Encapsulated Lead Configurations – Inches (Millimeters)
Lead Style
Symbol
N
L
M
J
K
(J) Formed
Lead Style
(N) Straight
(L) Formed
L
Lead Length
0.250 Min. (6.35)
0.070 ± 0.010 (1.78 ± 0.25)
0.045 ± 0.010 (1.14 ± 0.25)
0.070 ± 0.010 (1.78 ± 0.25)
0.045 ± 0.010 (1.14 ± 0.25)
Additional lead configurations may be available. Contact KEMET for details.
Before building the Matter firmware and experiencing the Telink Matter application, you need to prepare the compilation environment of the Matter project. The following will introduce in detail the st...
The Art of Software Debugging mainly describes how to use methods and debugging tools to automatically detect bugs in programs before customers complain. It focuses on the four core links of problem r...
[size=5][color=#ff0000][b]First of all, I wish you all a happy Teacher's Day!! [/b][/color][/size][size=4]During this festival, the Core Coin auction in our forum is still going on, and five auctions ...
[Ask if you don't understand] The TPS3802 chip is selected as the reset chip. The manual says that the reset time is 400ms (meets the requirement). But this 400ms is the delay implemented inside the c...
I am designing a small digital data acquisition instrument recently, which includes the commonly used 0-10V voltage measurement and 0-20mA current measurement. In the past, I have always used such a c...
In the past few years, autonomous driving technology has experienced unprecedented rapid development. With the accelerated implementation of L2 autonomous driving vehicles, the horn of L3 autonomous ...[Details]
At the financial report meeting on October 13, TSMC not only announced its Q3 quarter results, but also revealed the latest process progress. The demand for the 3nm process has exceeded expectations....[Details]
PLC ladder diagram programming language is a programming language used to write automation applications. Its name comes from the shape of the ladder diagram, each ladder represents a logical functi...[Details]
Semiconductor test interface manufacturer Chunghwa Precision Technology invested NT$2.7 billion to build a new operation and R&D headquarters, and held an inauguration ceremony on October 4. Looking ...[Details]
1 Introduction
The popularization of centralized heating and the implementation of metered heating are effective means of building energy conservation, but this needs to be achieved through...[Details]
Standalone film introduction
Single-chip microcomputers are abbreviated as MCUs. They are typical embedded microcontrollers (Microcontroller Units). The English abbreviation MCU is often u...[Details]
On September 24, China Three Gorges Energy, Shandong Provincial Energy Bureau and Shandong University of Science and Technology signed a strategic cooperation agreement and decided to jointly build...[Details]
Regarding smart driving, who do you think is the future, pure vision solution or lidar multi-sensor fusion perception solution? Why are we talking about this topic today? It's because another minor...[Details]
The BASCOM-8051 development environment is a single-chip microcomputer programming system based on the BASIC language. It is easy to learn and use, has powerful functions, and has a short dev...[Details]
On January 11, Dexing City and Raytheon Winston Battery Industry Chain (Shenzhen) Co., Ltd. held a signing ceremony for the energy storage rare earth water-soluble lithium yttrium battery intelligent ...[Details]
Active Power Management
On-chip power management techniques fall into two broad categories, managing active system power and managing standby power.
Active power management falls into t...[Details]
1 Introduction PWM, the English name Pulse Width Modulation, is the abbreviation of pulse width modulation. It modulates the width of a series of pulses to output the required waveform (including sha...[Details]
Recently, two patent drawings of OPPO's new phone were circulated on the Internet. As can be seen from the picture, the front of the phone uses the currently popular full-screen design. There are n...[Details]
1. Selection of pointer meter and digital meter: 1. The reading accuracy of the pointer meter is poor, but the process of the pointer swinging is more intuitive, and the swing speed and amplitude...[Details]
RF/Wirelessly
京公网安备 11010802033920号
EEWORLD
