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PIC16F819-I/PTSL

Description
8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size84KB,21 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Download user manual Parametric Compare View All

PIC16F819-I/PTSL Overview

8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O

PIC16F819-I/PTSL Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeDIP
package instructionDIP, DIP18,.3
Contacts18
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time7 weeks
Has ADCYES
Address bus width
bit size8
CPU seriesPIC
maximum clock frequency20 MHz
DMA channelNO
External data bus width
JESD-30 codeR-PDIP-T18
JESD-609 codee3
length22.86 mm
Number of I/O lines16
Number of terminals18
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)2048
ROM programmabilityFLASH
speed20 MHz
Maximum slew rate4.2 mA
Maximum supply voltage5.5 V
Minimum supply voltage4 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
M
Section 23. 10-bit A/D Converter
HIGHLIGHTS
This section of the manual contains the following major topics:
23.1 Introduction ..................................................................................................................23-2
23.2 Control Register ...........................................................................................................23-3
23.3 Operation .....................................................................................................................23-5
23.4 A/D Acquisition Requirements .....................................................................................23-6
23.5 Selecting the A/D Conversion Clock ............................................................................23-8
23.6 Configuring Analog Port Pins.......................................................................................23-9
23.7 A/D Conversions ........................................................................................................23-10
23.8 Operation During Sleep .............................................................................................23-14
23.9 Effects of a Reset.......................................................................................................23-14
23.10 A/D Accuracy/Error ....................................................................................................23-15
23.11 Connection Considerations ........................................................................................23-16
23.12 Transfer Function .......................................................................................................23-16
23.13 Initialization ................................................................................................................23-17
23.14 Design Tips ................................................................................................................23-18
23.15 Related Application Notes..........................................................................................23-19
23.16 Revision History .........................................................................................................23-20
23
10-bit
A/D Converter
Note 1:
At present NO released mid-range MCU devices are available with this module.
Devices are planned, but there is no schedule for availability. Please refer to Micro-
chip’s Web site or BBS for release of Product Briefs which detail the features of
devices.
If your current design requires a 10-bit A/D, please look at the PIC17C756 which has
a 12-channel 10-bit A/D. This A/D has characteristics which are identical to this mod-
ule’s description.
©
1997 Microchip Technology Inc.
Preliminary
DS31023A page 23-1

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Description 8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O 8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O 8-bit microcontrollers - mcu 1.75kb 64 ram 12i/O ext temp qfn 8-bit microcontrollers - mcu 3.5 KB 128 ram 22i/O 8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O 8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O 8-bit microcontrollers - mcu 1.75kb 64 ram 12i/O ind temp qfn
Is it Rohs certified? conform to - - conform to conform to conform to -
Maker Microchip Microchip - Microchip Microchip Microchip Microchip
Parts packaging code DIP QFN - QFN SOIC SOIC QFN
Contacts 18 28 - 28 18 18 16
Reach Compliance Code compliant compli - compli compli compli compliant
Factory Lead Time 7 weeks 8 weeks - 18 weeks 13 weeks - 6 weeks
Has ADC YES YES - YES YES YES NO
bit size 8 8 - 8 8 8 8
CPU series PIC PIC - PIC PIC PIC -
maximum clock frequency 20 MHz 20 MHz - 20 MHz 20 MHz 20 MHz 20 MHz
DMA channel NO NO - NO NO NO NO
JESD-30 code R-PDIP-T18 S-PQCC-N28 - S-PQCC-N28 R-PDSO-G18 R-PDSO-G18 S-XQCC-N16
JESD-609 code e3 - - e3 e3 e3 -
length 22.86 mm 6 mm - 6 mm 11.53 mm 11.53 mm -
Number of I/O lines 16 16 - 22 16 16 -
Number of terminals 18 28 - 28 18 18 16
Maximum operating temperature 85 °C 85 °C - 125 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C - -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES - YES YES YES NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
encapsulated code DIP QCCN - VQCCN SOP SOP QCCN
Encapsulate equivalent code DIP18,.3 LCC28,.24SQ,25 - LCC28,.24SQ,25 SOP18,.4 SOP18,.4 -
Package shape RECTANGULAR SQUARE - SQUARE RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE CHIP CARRIER - CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE CHIP CARRIER
power supply 5 V 5 V - 5 V 5 V 5 V -
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified -
RAM (bytes) 256 256 - 128 256 256 -
rom(word) 2048 2048 - 2048 2048 2048 -
ROM programmability FLASH FLASH - FLASH FLASH FLASH FLASH
speed 20 MHz 20 MHz - 20 MHz 20 MHz 20 MHz 20 MHz
Maximum slew rate 4.2 mA 4.2 mA - 15 mA 4.2 mA 4.2 mA -
Maximum supply voltage 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4 V 4 V - 4 V 4 V 4 V 4.5 V
Nominal supply voltage 5 V 5 V - 5 V 5 V 5 V 5 V
surface mount NO YES - YES YES YES YES
technology CMOS CMOS - CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL - AUTOMOTIVE INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) - annealed - - Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) -
Terminal form THROUGH-HOLE NO LEAD - NO LEAD GULL WING GULL WING NO LEAD
Terminal pitch 2.54 mm 0.635 mm - 0.65 mm 1.27 mm 1.27 mm -
Terminal location DUAL QUAD - QUAD DUAL DUAL QUAD
width 7.62 mm 6 mm - 6 mm 7.49 mm 7.49 mm -
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER - MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER, RISC
Is it lead-free? - Lead free - Lead free - Lead free Lead free
On-chip program ROM width - 14 - 14 - 14 14

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