PIC16F819-I/SOTSL datasheet, PDF

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PIC16F819-I/SOTSL: Description8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O; CategoryThe embedded processor and controller Microcontrollers and processors; File Size84KB，21 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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PIC16F819-I/SOTSL Overview

8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O

PIC16F819-I/SOTSL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	SOIC
Contacts	18
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	13 weeks
Has ADC	YES
Address bus width
bit size	8
CPU series	PIC
maximum clock frequency	20 MHz
DMA channel	NO
External data bus width
JESD-30 code	R-PDSO-G18
JESD-609 code	e3
length	11.53 mm
Humidity sensitivity level	1
Number of I/O lines	16
Number of terminals	18
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP18,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	2048
ROM programmability	FLASH
speed	20 MHz
Maximum slew rate	4.2 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	7.49 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

User Manual

AN964 - Software PID Control of an Inverted Pendulum Using the PIC16F684

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Section 23. 10-bit A/D Converter

HIGHLIGHTS

This section of the manual contains the following major topics:

23.1 Introduction ..................................................................................................................23-2

23.2 Control Register ...........................................................................................................23-3

23.3 Operation .....................................................................................................................23-5

23.4 A/D Acquisition Requirements .....................................................................................23-6

23.5 Selecting the A/D Conversion Clock ............................................................................23-8

23.6 Conﬁguring Analog Port Pins.......................................................................................23-9

23.7 A/D Conversions ........................................................................................................23-10

23.8 Operation During Sleep .............................................................................................23-14

23.9 Effects of a Reset.......................................................................................................23-14

23.10 A/D Accuracy/Error ....................................................................................................23-15

23.11 Connection Considerations ........................................................................................23-16

23.12 Transfer Function .......................................................................................................23-16

23.13 Initialization ................................................................................................................23-17

23.14 Design Tips ................................................................................................................23-18

23.15 Related Application Notes..........................................................................................23-19

23.16 Revision History .........................................................................................................23-20

10-bit

A/D Converter

Note 1:

At present NO released mid-range MCU devices are available with this module.

Devices are planned, but there is no schedule for availability. Please refer to Micro-

chip’s Web site or BBS for release of Product Briefs which detail the features of

devices.

If your current design requires a 10-bit A/D, please look at the PIC17C756 which has

a 12-channel 10-bit A/D. This A/D has characteristics which are identical to this mod-

ule’s description.

1997 Microchip Technology Inc.

Preliminary

DS31023A page 23-1

PIC16F819-I/SOTSL Related Products

	PIC16F819-I/SOTSL	PIC16F819T-I/MLTSL	PIC16F630-E/ML	PIC16F72-E/ML	PIC16F819T-I/SOTSL	PIC16F819-I/PTSL	PIC16F630T-I/ML
Description	8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O	8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O	8-bit microcontrollers - mcu 1.75kb 64 ram 12i/O ext temp qfn	8-bit microcontrollers - mcu 3.5 KB 128 ram 22i/O	8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O	8-bit microcontrollers - mcu 3.5 KB 256 ram 16i/O	8-bit microcontrollers - mcu 1.75kb 64 ram 12i/O ind temp qfn
Is it Rohs certified?	conform to	-	-	conform to	conform to	conform to	-
Maker	Microchip	Microchip	-	Microchip	Microchip	Microchip	Microchip
Parts packaging code	SOIC	QFN	-	QFN	SOIC	DIP	QFN
Contacts	18	28	-	28	18	18	16
Reach Compliance Code	compli	compli	-	compli	compli	compliant	compliant
Factory Lead Time	13 weeks	8 weeks	-	18 weeks	-	7 weeks	6 weeks
Has ADC	YES	YES	-	YES	YES	YES	NO
bit size	8	8	-	8	8	8	8
CPU series	PIC	PIC	-	PIC	PIC	PIC	-
maximum clock frequency	20 MHz	20 MHz	-	20 MHz	20 MHz	20 MHz	20 MHz
DMA channel	NO	NO	-	NO	NO	NO	NO
JESD-30 code	R-PDSO-G18	S-PQCC-N28	-	S-PQCC-N28	R-PDSO-G18	R-PDIP-T18	S-XQCC-N16
JESD-609 code	e3	-	-	e3	e3	e3	-
length	11.53 mm	6 mm	-	6 mm	11.53 mm	22.86 mm	-
Number of I/O lines	16	16	-	22	16	16	-
Number of terminals	18	28	-	28	18	18	16
Maximum operating temperature	85 °C	85 °C	-	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	-	YES	YES	YES	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	SOP	QCCN	-	VQCCN	SOP	DIP	QCCN
Encapsulate equivalent code	SOP18,.4	LCC28,.24SQ,25	-	LCC28,.24SQ,25	SOP18,.4	DIP18,.3	-
Package shape	RECTANGULAR	SQUARE	-	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE	CHIP CARRIER	-	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE	IN-LINE	CHIP CARRIER
power supply	5 V	5 V	-	5 V	5 V	5 V	-
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-
RAM (bytes)	256	256	-	128	256	256	-
rom(word)	2048	2048	-	2048	2048	2048	-
ROM programmability	FLASH	FLASH	-	FLASH	FLASH	FLASH	FLASH
speed	20 MHz	20 MHz	-	20 MHz	20 MHz	20 MHz	20 MHz
Maximum slew rate	4.2 mA	4.2 mA	-	15 mA	4.2 mA	4.2 mA	-
Maximum supply voltage	5.5 V	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4 V	4 V	-	4 V	4 V	4 V	4.5 V
Nominal supply voltage	5 V	5 V	-	5 V	5 V	5 V	5 V
surface mount	YES	YES	-	YES	YES	NO	YES
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed	-	-	Matte Tin (Sn) - annealed	Matte Tin (Sn)	Matte Tin (Sn) - annealed	-
Terminal form	GULL WING	NO LEAD	-	NO LEAD	GULL WING	THROUGH-HOLE	NO LEAD
Terminal pitch	1.27 mm	0.635 mm	-	0.65 mm	1.27 mm	2.54 mm	-
Terminal location	DUAL	QUAD	-	QUAD	DUAL	DUAL	QUAD
width	7.49 mm	6 mm	-	6 mm	7.49 mm	7.62 mm	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER, RISC
Is it lead-free?	-	Lead free	-	Lead free	Lead free	-	Lead free
On-chip program ROM width	-	14	-	14	14	-	14

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