Up-down converters sige 1700-2200mhz downconversion mixer
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Maxim |
| Parts packaging code | QFN |
| package instruction | HVQCCN, |
| Contacts | 20 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 25 weeks |
| JESD-30 code | S-XQCC-N20 |
| length | 5 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Maximum seat height | 0.8 mm |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Telecom integrated circuit types | RF AND BASEBAND CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 5 mm |
| MAX9994ETP+ | MAX9994ETP+T | |
|---|---|---|
| Description | Up-down converters sige 1700-2200mhz downconversion mixer | Up-down converters sige 1700-2200mhz downconversion mixer |
| Is it lead-free? | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to |
| Maker | Maxim | Maxim |
| Parts packaging code | QFN | QFN |
| package instruction | HVQCCN, | HVQCCN, |
| Contacts | 20 | 20 |
| Reach Compliance Code | compliant | compliant |
| ECCN code | EAR99 | EAR99 |
| Factory Lead Time | 25 weeks | 6 weeks |
| JESD-30 code | S-XQCC-N20 | S-XQCC-N20 |
| length | 5 mm | 5 mm |
| Humidity sensitivity level | 1 | 1 |
| Number of functions | 1 | 1 |
| Number of terminals | 20 | 20 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | HVQCCN | HVQCCN |
| Package shape | SQUARE | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| Maximum seat height | 0.8 mm | 0.8 mm |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | YES | YES |
| technology | BICMOS | BICMOS |
| Telecom integrated circuit types | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | NO LEAD |
| Terminal pitch | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 5 mm | 5 mm |
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