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MAX9994ETP+T

Description
Up-down converters sige 1700-2200mhz downconversion mixer
CategoryWireless rf/communication    Telecom circuit   
File Size362KB,15 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Environmental Compliance
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MAX9994ETP+T Overview

Up-down converters sige 1700-2200mhz downconversion mixer

MAX9994ETP+T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMaxim
Parts packaging codeQFN
package instructionHVQCCN,
Contacts20
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time6 weeks
JESD-30 codeS-XQCC-N20
length5 mm
Humidity sensitivity level1
Number of functions1
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height0.8 mm
Nominal supply voltage5 V
surface mountYES
technologyBICMOS
Telecom integrated circuit typesRF AND BASEBAND CIRCUIT
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width5 mm

MAX9994ETP+T Related Products

MAX9994ETP+T MAX9994ETP+
Description Up-down converters sige 1700-2200mhz downconversion mixer Up-down converters sige 1700-2200mhz downconversion mixer
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker Maxim Maxim
Parts packaging code QFN QFN
package instruction HVQCCN, HVQCCN,
Contacts 20 20
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
Factory Lead Time 6 weeks 25 weeks
JESD-30 code S-XQCC-N20 S-XQCC-N20
length 5 mm 5 mm
Humidity sensitivity level 1 1
Number of functions 1 1
Number of terminals 20 20
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code HVQCCN HVQCCN
Package shape SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Maximum seat height 0.8 mm 0.8 mm
Nominal supply voltage 5 V 5 V
surface mount YES YES
technology BICMOS BICMOS
Telecom integrated circuit types RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD
Terminal pitch 0.65 mm 0.65 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 5 mm 5 mm

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