DS75361N-8/B+ datasheet, PDF - EEWORLD Datasheet

DS75361N-8/B+: DescriptionIC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC; Categorylogic logic; File Size307KB，5 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DS75361N-8/B+ Overview

IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
Logic integrated circuit type	LOGIC CIRCUIT
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

	DS75361N-8/B+	DS75361N-8/A+	DS75361J-8/A+	DS75361J
Description	IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC	IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC	IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC	IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	compliant
JESD-30 code	R-PDIP-T8	R-PDIP-T8	R-XDIP-T8	R-XDIP-T8
JESD-609 code	e0	e0	e0	e0
Logic integrated circuit type	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT
Number of terminals	8	8	8	8
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	-
package instruction	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	-

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