EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

DS75361J

Description
IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC
Categorylogic    logic   
File Size307KB,5 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

DS75361J Overview

IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC

DS75361J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codecompliant
JESD-30 codeR-XDIP-T8
JESD-609 codee0
Logic integrated circuit typeLOGIC CIRCUIT
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
surface mountNO
technologyBIPOLAR
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

DS75361J Related Products

DS75361J DS75361N-8/B+ DS75361N-8/A+ DS75361J-8/A+
Description IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Reach Compliance Code compliant unknown unknown unknown
JESD-30 code R-XDIP-T8 R-PDIP-T8 R-PDIP-T8 R-XDIP-T8
JESD-609 code e0 e0 e0 e0
Logic integrated circuit type LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT
Number of terminals 8 8 8 8
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
surface mount NO NO NO NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1
Maker - National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
package instruction - DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号