IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Reach Compliance Code | compliant |
JESD-30 code | R-XDIP-T8 |
JESD-609 code | e0 |
Logic integrated circuit type | LOGIC CIRCUIT |
Number of terminals | 8 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
surface mount | NO |
technology | BIPOLAR |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
DS75361J | DS75361N-8/B+ | DS75361N-8/A+ | DS75361J-8/A+ | |
---|---|---|---|---|
Description | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,PLASTIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,8PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | compliant | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-XDIP-T8 |
JESD-609 code | e0 | e0 | e0 | e0 |
Logic integrated circuit type | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
Number of terminals | 8 | 8 | 8 | 8 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
surface mount | NO | NO | NO | NO |
technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 |
Maker | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
package instruction | - | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 |