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5962-9461106H9X

Description
SRAM Module, 512KX32, 45ns, CMOS, CQMA68, 23.90 X 23.90 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68
Categorystorage    storage   
File Size468KB,13 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9461106H9X Overview

SRAM Module, 512KX32, 45ns, CMOS, CQMA68, 23.90 X 23.90 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68

5962-9461106H9X Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeQMA
package instruction,
Contacts68
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time45 ns
Other featuresIT CAN ALSO BE CONFIGURED AS 2M X 8
Spare memory width16
JESD-30 codeS-CQMA-G68
JESD-609 codee4
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
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