CPACK-16, Tube
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | CPACK |
| package instruction | DFP, FL16,.3 |
| Contacts | 16 |
| Manufacturer packaging code | CP16 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Other features | 3 ENABLE INPUTS |
| series | FCT |
| JESD-30 code | R-CDFP-F16 |
| JESD-609 code | e0 |
| length | 10.16 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | OTHER DECODER/DRIVER |
| MaximumI(ol) | 0.032 A |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output polarity | INVERTED |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 12 ns |
| propagation delay (tpd) | 12 ns |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 2.159 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 6.731 mm |
| Base Number Matches | 1 |
| 5962-8765401FA | 5962-87654022A | 5962-8765402FA | 5962-8765402EA | 5962-87654012A | 5962-8765401EA | |
|---|---|---|---|---|---|---|
| Description | CPACK-16, Tube | LCC-20, Tube | CPACK-16, Tube | CDIP-16, Tube | LCC-20, Tube | CDIP-16, Tube |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | CPACK | LCC | CPACK | CDIP | LCC | CDIP |
| package instruction | DFP, FL16,.3 | QCCN, | DFP, | 0.300 INCH, CERDIP-16 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 |
| Contacts | 16 | 20 | 16 | 16 | 20 | 16 |
| Manufacturer packaging code | CP16 | LC20 | CP16 | CD16 | LC20 | CD16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS |
| series | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 code | R-CDFP-F16 | S-CQCC-N20 | R-CDFP-F16 | R-GDIP-T16 | S-CQCC-N20 | R-GDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 10.16 mm | 8.89 mm | 10.16 mm | 20.066 mm | 8.89 mm | 20.066 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 20 | 16 | 16 | 20 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | QCCN | DFP | DIP | QCCN | DIP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 | 240 | 260 | 240 | 240 | 240 |
| propagation delay (tpd) | 12 ns | 7.8 ns | 7.8 ns | 7.8 ns | 12 ns | 12 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.159 mm | 2.54 mm | 2.159 mm | 5.08 mm | 2.54 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 6.731 mm | 8.89 mm | 6.731 mm | 7.62 mm | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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