ARM Microcontrollers - MCU 1000 SERIES - STELLARIS MICROCONTROLLER
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | LFBGA, BGA108,12X12,32 |
Contacts | 108 |
Reach Compliance Code | unknown |
Has ADC | YES |
Address bus width | |
bit size | 32 |
maximum clock frequency | 0.032 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | |
JESD-30 code | S-PBGA-B108 |
length | 10 mm |
Number of I/O lines | 67 |
Number of terminals | 108 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA108,12X12,32 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.2,3.3 V |
Certification status | Not Qualified |
RAM (bytes) | 32768 |
rom(word) | 262144 |
ROM programmability | FLASH |
Maximum seat height | 1.5 mm |
speed | 80 MHz |
Maximum supply voltage | 1.32 V |
Minimum supply voltage | 1.08 V |
Nominal supply voltage | 1.2 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
LM3S1811-IBZ50-C1T | LM3S1811-IQC50-C3 | LM3S1811-IQC50-C3T | LM3S1811-IBZ50-C3T | LM3S1811-IBZ50-C3 | LM3S1811-IQC50-C0T | LM3S1811-IQC50-C0 | LM3S1811-IBZ50-C1 | |
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Description | ARM Microcontrollers - MCU 1000 SERIES - STELLARIS MICROCONTROLLER | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU Stellaris MCU | ARM Microcontrollers - MCU 32B ARM Cortex MCU | ARM Microcontrollers - MCU 32B ARM Cortex MCU | ARM Microcontrollers - MCU 1000 SERIES - STELLARIS MICROCONTROLLER |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | - | - | conform to |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | - | Texas Instruments |
Parts packaging code | BGA | QFP | QFP | BGA | BGA | - | - | BGA |
package instruction | LFBGA, BGA108,12X12,32 | LFQFP, QFP100,.63SQ,20 | LFQFP, QFP100,.63SQ,20 | LFBGA, BGA108,12X12,32 | LFBGA, BGA108,12X12,32 | - | - | LFBGA, BGA108,12X12,32 |
Contacts | 108 | 100 | 100 | 108 | 108 | - | - | 108 |
Reach Compliance Code | unknown | compli | compli | compli | compliant | - | - | unknown |
Has ADC | YES | YES | YES | YES | YES | - | - | YES |
bit size | 32 | 32 | 32 | 32 | 32 | - | - | 32 |
maximum clock frequency | 0.032 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | - | - | 0.032 MHz |
DAC channel | NO | NO | NO | NO | NO | - | - | NO |
DMA channel | YES | YES | YES | YES | YES | - | - | YES |
JESD-30 code | S-PBGA-B108 | S-PQFP-G100 | S-PQFP-G100 | S-PBGA-B108 | S-PBGA-B108 | - | - | S-PBGA-B108 |
length | 10 mm | 14 mm | 14 mm | 10 mm | 10 mm | - | - | 10 mm |
Number of I/O lines | 67 | 67 | 67 | 67 | 67 | - | - | 67 |
Number of terminals | 108 | 100 | 100 | 108 | 108 | - | - | 108 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | - | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | -40 °C |
PWM channel | YES | YES | YES | YES | YES | - | - | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
encapsulated code | LFBGA | LFQFP | LFQFP | LFBGA | LFBGA | - | - | LFBGA |
Encapsulate equivalent code | BGA108,12X12,32 | QFP100,.63SQ,20 | QFP100,.63SQ,20 | BGA108,12X12,32 | BGA108,12X12,32 | - | - | BGA108,12X12,32 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | - | SQUARE |
Package form | GRID ARRAY | FLATPACK | FLATPACK | GRID ARRAY | GRID ARRAY | - | - | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 260 | 260 | 260 | 260 | - | - | NOT SPECIFIED |
power supply | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | - | - | 1.2,3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
RAM (bytes) | 32768 | 32768 | 32768 | 32768 | 32768 | - | - | 32768 |
rom(word) | 262144 | 262144 | 262144 | 262144 | 262144 | - | - | 262144 |
ROM programmability | FLASH | FLASH | FLASH | FLASH | FLASH | - | - | FLASH |
Maximum seat height | 1.5 mm | 1.6 mm | 1.6 mm | 1.5 mm | 1.5 mm | - | - | 1.5 mm |
speed | 80 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | - | - | 80 MHz |
Maximum supply voltage | 1.32 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | - | 1.32 V |
Minimum supply voltage | 1.08 V | 3 V | 3 V | 3 V | 3 V | - | - | 1.08 V |
Nominal supply voltage | 1.2 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | 1.2 V |
surface mount | YES | YES | YES | YES | YES | - | - | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL |
Terminal form | BALL | GULL WING | GULL WING | BALL | BALL | - | - | BALL |
Terminal pitch | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm | - | - | 0.8 mm |
Terminal location | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM | - | - | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
width | 10 mm | 14 mm | 14 mm | 10 mm | 10 mm | - | - | 10 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | - | MICROCONTROLLER |