LM3S1811-IBZ50-C3 datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> LM3S1811-IBZ50-C3

LM3S1811-IBZ50-C3: DescriptionARM Microcontrollers - MCU Stellaris MCU; CategoryThe embedded processor and controller Microcontrollers and processors; File Size6MB，948 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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LM3S1811-IBZ50-C3 Overview

ARM Microcontrollers - MCU Stellaris MCU

LM3S1811-IBZ50-C3 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA108,12X12,32
Contacts	108
Reach Compliance Code	compliant
Factory Lead Time	1 week
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B108
JESD-609 code	e1
length	10 mm
Humidity sensitivity level	3
Number of I/O lines	67
Number of terminals	108
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA108,12X12,32
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	1.2,3.3 V
Certification status	Not Qualified
RAM (bytes)	32768
rom(word)	262144
ROM programmability	FLASH
Maximum seat height	1.5 mm
speed	50 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Is it Rohs certified?	conform to	conform to	conform to	conform to	-	-	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	-	Texas Instruments	Texas Instruments
Parts packaging code	BGA	QFP	QFP	BGA	-	-	BGA	BGA
package instruction	LFBGA, BGA108,12X12,32	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	LFBGA, BGA108,12X12,32	-	-	LFBGA, BGA108,12X12,32	LFBGA, BGA108,12X12,32
Contacts	108	100	100	108	-	-	108	108
Reach Compliance Code	compliant	compli	compli	compli	-	-	unknown	unknown
Has ADC	YES	YES	YES	YES	-	-	YES	YES
bit size	32	32	32	32	-	-	32	32
maximum clock frequency	16 MHz	16 MHz	16 MHz	16 MHz	-	-	0.032 MHz	0.032 MHz
DAC channel	NO	NO	NO	NO	-	-	NO	NO
DMA channel	YES	YES	YES	YES	-	-	YES	YES
JESD-30 code	S-PBGA-B108	S-PQFP-G100	S-PQFP-G100	S-PBGA-B108	-	-	S-PBGA-B108	S-PBGA-B108
length	10 mm	14 mm	14 mm	10 mm	-	-	10 mm	10 mm
Number of I/O lines	67	67	67	67	-	-	67	67
Number of terminals	108	100	100	108	-	-	108	108
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	-	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	-	-	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFQFP	LFQFP	LFBGA	-	-	LFBGA	LFBGA
Encapsulate equivalent code	BGA108,12X12,32	QFP100,.63SQ,20	QFP100,.63SQ,20	BGA108,12X12,32	-	-	BGA108,12X12,32	BGA108,12X12,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	-	-	SQUARE	SQUARE
Package form	GRID ARRAY	FLATPACK	FLATPACK	GRID ARRAY	-	-	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260	260	260	-	-	NOT SPECIFIED	NOT SPECIFIED
power supply	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	-	-	1.2,3.3 V	1.2,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified
RAM (bytes)	32768	32768	32768	32768	-	-	32768	32768
rom(word)	262144	262144	262144	262144	-	-	262144	262144
ROM programmability	FLASH	FLASH	FLASH	FLASH	-	-	FLASH	FLASH
Maximum seat height	1.5 mm	1.6 mm	1.6 mm	1.5 mm	-	-	1.5 mm	1.5 mm
speed	50 MHz	50 MHz	50 MHz	50 MHz	-	-	80 MHz	80 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	-	-	1.32 V	1.32 V
Minimum supply voltage	3 V	3 V	3 V	3 V	-	-	1.08 V	1.08 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	-	-	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	-	-	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	-	-	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	-	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	GULL WING	BALL	-	-	BALL	BALL
Terminal pitch	0.8 mm	0.5 mm	0.5 mm	0.8 mm	-	-	0.8 mm	0.8 mm
Terminal location	BOTTOM	QUAD	QUAD	BOTTOM	-	-	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED
width	10 mm	14 mm	14 mm	10 mm	-	-	10 mm	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	-	MICROCONTROLLER	MICROCONTROLLER

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