CapSense Express™ Button
Capacitive Controllers
CapSense
®
Express™ Button Capacitive Controllers
CY8C20110, CY8C20180
CY8C20160, CY8C20140
CY8C20142
®
Features
■
■
10/8/6/4 capacitive button input
❐
Robust sensing algorithm
❐
High sensitivity, low noise
❐
Immunity to RF and AC noise
❐
Low radiated EMC noise
❐
Supports wide range of input capacitance, sensor shapes,
and sizes
Target applications
❐
Printers
❐
Cellular handsets
❐
LCD monitors
❐
Portable DVD players
Low operating current
❐
Active current: continuous sensor scan: 1.5 mA
❐
Deep sleep current: 4 µA
Industry's best configurability
❐
Custom sensor tuning, one optional capacitor
❐
Output supports strong drive for LED
2
❐
Output state can be controlled through I C or directly from
®
input state
CapSense
2
❐
Run time reconfigurable over I C
Advanced features
❐
All GPIOs support LED dimming with configurable delay
option in CY8C20110
❐
Interrupt outputs
❐
User defined inputs
❐
Wake on interrupt input
❐
Sleep control pin
❐
Nonvolatile storage of custom settings
❐
Easy integration into existing products – configure output to
match system
❐
No external components required
❐
World-class free configuration tool
Wide range of operating voltages
❐
2.4 V to 2.9 V
❐
3.10 V to 3.6 V
❐
4.75 V to 5.25 V
I
2
C communication
❐
Supported from 1.8 V
❐
Internal pull-up resistor support option
❐
Data rate up to 400 kbps
2
❐
Configurable I C addressing
Industrial temperature range: –40 °C to +85 °C
Available in 16-pin QFN, 8-pin, and 16-pin SOIC packages
■
■
■
■
Overview
These CapSense Express™ controllers support four to ten
capacitive sensing (CapSense) buttons. The device functionality
is configured through an I
2
C port and can be stored in onboard
nonvolatile memory for automatic loading at power-on. The
CY8C20110 is optimized for dimming LEDs in 15 selectable duty
cycles for back light applications. The device can be configured
to have up to 10 GPIOs connected to the PWM output. The PWM
duty cycle is programmable for variable LED intensities.
The four key blocks that make up these devices are: a robust
capacitive sensing core with high immunity against radiated and
conductive noise, control registers with nonvolatile storage,
configurable outputs, and I
2
C communications. The user can
configure registers with parameters needed to adjust the
operation and sensitivity of the CapSense buttons and outputs
and permanently store the settings. The standard I
2
C serial
communication interface enables the host to configure the
device and read sensor information in real time. The I
2
C address
is fully configurable without any external hardware strapping.
■
■
■
Errata:
For information on silicon errata, see
“Errata”
on page 40. Details include trigger conditions, devices affected, and proposed workaround.
Cypress Semiconductor Corporation
Document Number: 001-54606 Rev. *K
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised September 1, 2014
CY8C20110, CY8C20180
CY8C20160, CY8C20140
CY8C20142
Contents
Pinouts -16-Pin QFN ......................................................... 3
Pin Definitions .................................................................. 3
Pinouts - 16-Pin SOIC ....................................................... 4
Pin Definitions .................................................................. 4
Pinouts - 8-pin SOIC ......................................................... 5
Pin Definitions .................................................................. 5
Typical Circuits ................................................................. 6
I2C Interface ...................................................................... 8
I2C Device Addressing ................................................ 8
I2C Clock Stretching .................................................... 8
Format for Register Write and Read ........................... 9
Operating Modes of I2C Commands ............................. 10
Normal Mode ............................................................. 10
Setup Mode ............................................................... 10
Device Operation Modes ................................................ 10
Active Mode ............................................................... 10
Periodic Sleep Mode ................................................. 10
Deep Sleep Mode ...................................................... 10
Sleep Control Pin ............................................................ 10
Interrupt Pin to Master ................................................... 10
LED Dimming .................................................................. 10
LED Dimming Mode 1: Change Intensity on ON/OFF Button
Status ............................................................................... 11
LED Dimming Mode 2: Flash Intensity on ON Button
Status ........................................................................ 11
LED Dimming Mode 3: Hold Intensity After ON/OFF Button
Transition .......................................................................... 12
LED Dimming Mode 4: Toggle Intensity on ON/OFF or
OFF/ON Button Transitions .............................................. 12
Registers ......................................................................... 13
Register Map ............................................................. 13
Device IDs ................................................................. 17
CapSense Express Commands ................................ 17
Register Conventions ................................................ 17
Layout Guidelines and Best Practices ......................... 18
CapSense Button Shapes ......................................... 18
Button Layout Design ................................................ 18
Recommended via Hole Placement .......................... 18
Example PCB Layout Design with Two CapSense Buttons
and Two LEDs .................................................................. 20
Operating Voltages ......................................................... 21
CapSense Constraints ................................................... 21
Absolute Maximum Ratings .......................................... 22
Operating Temperature .................................................. 22
Electrical Specifications ................................................ 23
DC Electrical Specifications ...................................... 23
CapSense Electrical Characteristics ......................... 26
AC Electrical Specifications ....................................... 26
Appendix ......................................................................... 29
Examples of Frequently Used I2C Commands ......... 29
Ordering Information ...................................................... 30
Ordering Code Definitions ......................................... 30
Thermal Impedances ..................................................... 31
Solder Reflow Specifications ........................................ 31
Package Diagrams .......................................................... 32
Acronyms ........................................................................ 35
Reference Documents .................................................... 35
Document Conventions ................................................. 35
Units of Measure ....................................................... 35
Numeric Conventions ................................................ 35
Glossary .......................................................................... 36
Errata ............................................................................... 41
CY8C20110 ............................................................... 41
CY8C20140/142/160/180/1A0 .................................. 42
Document History Page ................................................. 44
Sales, Solutions, and Legal Information ...................... 46
Worldwide Sales and Design Support ....................... 46
Products .................................................................... 46
PSoC® Solutions ...................................................... 46
Cypress Developer Community ................................. 46
Technical Support ..................................................... 46
Document Number: 001-54606 Rev. *K
Page 2 of 45
CY8C20110, CY8C20180
CY8C20160, CY8C20140
CY8C20142
Pinouts -16-Pin QFN
Figure 1. 16-pin QFN (3 × 3 × 0.6 mm) (no e-pad) Pinout
[1]
QFN
Pin Definitions
16-pin QFN (no e-pad)
[1, 2]
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pin Name
GP0[0]
GP0[1]
I
2
C SCL
I
2
C SDA
GP1[0]
GP1[1]
VSS
GP1[2]
[3]
GP1[3]
GP1[4]
XRES
GP0[2]
VDD
GP0[3]
CSInt
GP0[4]
[3]
Description
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
I
2
C clock
I
2
C data
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Ground connection
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Active high external reset with internal pull-down
Configurable as CapSense or GPIO
Supply voltage
Configurable as CapSense or GPIO
Integrating capacitor Input. The external capacitance is required only if 5:1 SNR cannot be achieved.
Typical range is 1 nF to 4.7 nF
Configurable as CapSense or GPIO
Notes
1. CY8C20110 (10 Buttons) / CY8C20180 (8 Buttons) / CY8C20160 (6 Buttons) / CY8C20140 (4 Buttons)
2. 8/6/4 available configurable IOs can be configured to any of the 10 IOs of the package. After any of the 8/6/4 IOs are chosen, the remaining 2/4/6 IOs of the package
are not available for any functionality.
3. Avoid using GP1[1] and GP1[2] for driving LEDs. These two pins have special functions during power-up which is used at factory. LEDs connected to these two pins
blink during the power-up of the device.
Document Number: 001-54606 Rev. *K
Page 3 of 45
CY8C20110, CY8C20180
CY8C20160, CY8C20140
CY8C20142
Pinouts - 16-Pin SOIC
Figure 2. 16-pin SOIC (150 Mils) Pinout
[4]
VDD
VSS
Pin Definitions
16-pin SOIC
[4, 5]
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Name
GP0[3]
CSint
GP0[4]
GP0[0]
GP0[1]
I
2
C
SCL
I
2
C SDA
GP1[0]
GP1[1]
[6]
VSS
GP1[2]
[6]
GP1[3]
GP1[4]
XRES
GP0[2]
VDD
Configurable as CapSense or GPIO
Integrating capacitor input. The external capacitance is required only if 5:1 SNR cannot be achieved.
Typical range is 1 nF to 4.7 nF.
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
I
2
C clock
I
2
C data
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Ground connection
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Active high external reset with internal pull-down
Configurable as CapSense or GPIO
Supply voltage
Description
Notes
4. CY8C20110 (10 Buttons) / CY8C20180 (8 Buttons) / CY8C20160 (6 Buttons) / CY8C20140 (4 Buttons)
5. 8/6/4 available configurable IOs can be configured to any of the 10 IOs of the package. After any of the 8/6/4 IOs are chosen, the remaining 2/4/6 IOs of the package
are not available for any functionality.
6. Avoid using GP1[1] and GP1[2] for driving LEDs. These two pins have special functions during power-up which is used at factory. LEDs connected to these two pins
blink during the power-up of the device.
Document Number: 001-54606 Rev. *K
Page 4 of 45
CY8C20110, CY8C20180
CY8C20160, CY8C20140
CY8C20142
Pinouts - 8-pin SOIC
Figure 3. 8-pin SOIC (150 Mils) pinout
CY8C20142 (4 Button)
Pin Definitions
8-pin SOIC
CY8C20142 (4 Button)
Pin No.
1
2
3
4
5
6
7
8
Name
VSS
I
2
C SCL
I
2
C SDA
GP1[0]
[7]
GP1[1]
[7]
Description
Ground
I
2
C Clock
I
2
C Data
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Supply voltage
GP0[0]
GP0[1]
VDD
Important Note
For information on the preferred dimensions for mounting QFN packages, see the "Application Notes for Surface
Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages" available at
http://www.amkor.com.
Note
7. Avoid using GP1[0] and GP1[1] for driving LED. These two pins have special functions during power up which is used at factory. LEDs connected to these two pins
will blink during power up of the device.
Document Number: 001-54606 Rev. *K
Page 5 of 45
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