Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
Data Sheet
HQM / 0603 / 50V
B37933-K5***-***
Hi-Q Capacitors 0603
Description
The “High-Q-series” was designed for wireless communications and high frequency applications.
The “High-Q-Capacitors” have a class 1 dielectric ceramic and copper inner electrode. The class 1
dielectric ceramic used, HQM, is a very stable dielectric offering a temperature coefficient of
capacitance (TCC) of 0± 60ppm/°C. The higher conductivity of copper give a lower ESR. These
advantages mean a improved performance of matching circuits, lower power dissipation and less
energy absorption.
Features
Ultra low ESR and high Q-factor
Tight capacitance tolerances
Class 1 capacitor with Cu-inner-electrodes
High stability with respect of time, temperature, frequency and voltage
Excellent attenuation
High self resonance frequency
Lead free component
AgNiSn (Nickel
Barrier)
Termination
Applications
Cellular Communication
Bluetooth
DECT
Cable TV
Satellite TV (LNB)
GPS
Vehicle Location Systems
Paging
Test and Measurement
Filters
RF Amplifiers
VCO´s
HIPERLAN
EPCOS KB VS PE
Revision:
d/2001
Page 1 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
Data Sheet
HQM / 0603 / 50V
B37933-K5***-***
Ordering Code
Chip
B37933
Type and Size:
HQM / 0603
-
K 5 100
-
J 5 60
Termination Type:
K = Cu/Ni/Sn
Rated Voltage:
5 = 50V
Rated Capacitance:
100 = 10 x 10
0
pF
Capacitance Tolerance:
C<10pF: B = ±0.1pF C = ±0.25pF
K = ±10%
C>10pF: J = ±5%
Decimal place:
for cap. values <10pF, otherwise not used
Packaging code:
01 = bulk case
60 = card board, 180mm reel
Sample Kit
B37933
-
K 5 999
-
J 99
Cap values:
0.4, 0.5, 0.7, 0.8, 0.9, 1.0, 1.2, 1.5, 1.8, 2.2,
3.3, 3.9, 4.7, 5.6, 6.8, 8.2, 10, 12, 15, 18
Capacitance Tolerance:
C<3.9pF: B = ±0.1pF
4.7pF<C10pF C = ±0.25pF
C>10pF: J = ±5%
EPCOS KB VS PE
Revision:
d/2001
Page 2 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
Data Sheet
HQM / 0603 / 50V
B37933-K5***-***
Figure
l
Symbol
b
l
b
s
k
s
Min
1.45
0.70
0.70
0.25
Max
1.75
0.90
0.90
0.50
Unit
mm
mm
mm
mm
Dimensions and tolerances in accordance with
CECC 32101-801
k
Electrical Data
Capacitance Test Conditions
Test frequency:
Test voltage:
Reference Temperature
Dissipation factor tan
δ
(limit value):
Insulation Resistance:
Ageing:
Temperature coefficient (tolerance)
Operating Temperature Range:
Climatic category (IEC 68-1):
Capacitance Range:
1.0 MHz ± 0,2 MHz
1.0 V ± 0.2 V
25°C ± 1°C (EIA)
< 1.0 x 10
-3
> 10
5
MΩ
none
0 ± 60*10
-6
1/K
-55°C ... +125°C
55/125/56
0.4 ... 82pF (up from 1pF Series E12)
RF Measuring Systems Performance
S-Parameter Measuring Configuration:
HP 8753D (30kHz – 6GHz)
HP 8722D (1MHz – 40GHz)
samples soldered on microstrip PCB’s
Measuring Direction: Shunt
Impedance Measuring Configuration:
Agilent E 4991A (1MHz – 3GHz)
Test fixture 16197A
parts not soldered
EPCOS KB VS PE
Revision:
d/2001
Page 3 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
Data Sheet
HQM / 0603 / 50V
B37933-K5***-***
Typical RF Performance
Capacitance
[pF]
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
f
res
1
ESR@ 1GHz
[mΩ]
Ω]
445
400
385
345
325
315
300
275
250
240
215
200
185
175
165
150
140
130
120
110
102
96
88
80
2
Q@ 1GHz
860
805
755
635
595
560
525
455
395
360
305
270
235
210
185
160
135
115
96
76
62
50
34
26
2
ESR@ f
res
[mΩ]
Ω]
595
540
510
440
410
390
365
335
300
285
250
235
210
200
185
170
155
140
130
118
108
100
90
82
2
[MHz]
17800
17100
13600
12200
11400
10600
9600
8800
7900
6900
5750
5100
4700
4150
3550
3130
2850
2730
2580
2400
2150
2050
1870
1780
Capacitance
[pF]
82
f
res
1
ESR@ 300MHz
2
Q@ 300MHz
105
2
ESR@ f
res
[mΩ]
Ω]
52
2
[MHz]
930
[mΩ]
Ω]
52
1
2
Impedance Analyser E 4991A, parts not soldered
Network Analyser HP 8753D, parts soldered
EPCOS KB VS PE
Revision:
d/2001
Page 4 of 11
15.10.01
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
Data Sheet
HQM / 0603 / 50V
B37933-K5***-***
Fig. 1: Typical ESR for different Frequencies vs.
3
Capacitance
1000
Fig. 2: Typical Q Factor for different Frequencies vs.
3
Capacitance
10000
3 GHz
1 GHz
1000
1 GHz
100 MHz
ESR[m
Ω
]
100
100 MHz
300 MHz
Q
3 GHz
300 MHz
100
10
0.1
1
C [pF]
10
100
10
0.1
1
C [pF]
10
100
Fig. 3: Typical Self Resonant Frequencies vs.
3
Capacitance
100000
Fig. 4: Typical ESR at Resonant Frequencies for
4
soldered parts vs. Capacitance
1000
10000
fres [MHz]
ESR [m
Ω
]
1000
100
0.1
1
C [pF]
10
100
100
10
0.1
1
C [pF]
10
100
Fig. 5: Typical ESR for different Capacitances vs.
3
Frequency
10
Fig. 6: Typical Q Factor for different Capacitances vs.
3
Frequency
10000
1000
1
Ω
0.4pF
0.4pF
3.3pF
3.3pF
12pF
100
12pF
27pF
0.1
27pF
10
0.01
100
1000
Frequency [MHz]
10000
1
100
1000
Frequency [MHz]
10000
3
4
Impedance Analyser E 4991A, parts not soldered
Network Analyser HP 8753D, parts soldered
EPCOS KB VS PE
Revision:
d/2001
Page 5 of 11
15.10.01
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
