1FRH360-762GGCS datasheet, PDF

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1FRH360-762GGCS: DescriptionIC Socket, BGA360, 360 Contact(s),; CategoryThe connector socket; File Size433KB，2 Pages; ManufacturerAdvanced Interconnections Corp.; Environmental Compliance

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1FRH360-762GGCS Overview

IC Socket, BGA360, 360 Contact(s),

1FRH360-762GGCS Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Reach Compliance Code	compli
ECCN code	EAR99
Contact to complete cooperation	GOLD OVER NICKEL
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrie
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	BGA360
Shell material	LIQUID CRYSTAL POLYMER
JESD-609 code	e4
Number of contacts	360
Base Number Matches	1

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Flip-Top

BGA Sockets

Flip-Top BGA Sockets

1.27mm and 1.00mm Pitch

Table of Models

Description:

Socket (FRG, 1.27mm pitch)

Guide Box and Base Mat’l: High Temp. Liquid

Crystal Polymer (LCP)

Index: -40°C to 260°C (-40°F to 500°F)

Description:

Socket (FRH, 1.00mm pitch)

Guide Box Mat’l: High Temp. Liquid Crystal

Polymer (LCP)

Index: -40°C to 260°C (-40°F to 500°F)

Base Mat’l: FR-4 Glass Filled Epoxy

Index: -40°C to 140°C (-40°F to 284°F)

Socket Size:

3.00mm wider and

10.00mm longer than

BGA device (for

packages larger than

15.00mm square).*

Socket Size:

3.00mm wider and

10.00mm longer than

BGA device (for

packages larger than

15.00mm square).*

Features:

• Designed to save space on new

and existing PC boards in test,

development, programming and

production applications.

• No external hold-downs or

soldering of BGA device required.

• AIC exclusive solder ball terminals

offer superior processing.

• Uses same footprint as BGA device.

• Available with integral, finned heat

sink or coin screw clamp

assembly.

FRG replaces FTG.

* For device packages smaller than 15.00mm square, the socket size is X = .709/(18.00)

and Y = .984/(25.00).

How It Works

SMT models are shipped un-assembled to ease

solderability. Thru-hole models are shipped fully

assembled.

Chip support plate

(supplied)

BGA or LGA

device

Upper

assembly

Lower

assembly

1. Lower assembly is soldered to PC board with no

external hold-down mechanism. Thru-hole models may

be soldered to PC board or plugged into a mating

socket.

2. Upper assembly inserts easily to lower assembly by

aligning guide posts and installing four (supplied)

screws.

4. Lid opens easily by pressing latch.

Specifications:

Terminals:

Brass - Copper Alloy

(C36000) ASTM-B-16

Contacts:

Beryllium Copper

(C17200) ASTM-B-194

Plating:

G - Gold over Nickel

Terminal Support:

Polyimide Film

Spring Material:

Stainless Steel

Lid, Latch, Heat Sink/Coin Screw

and Support Plate Material:

Aluminum

Solder Ball:

Standard: 63Sn/37Pb

Lead-free: 95.5Sn/4.0Ag/0.5Cu

3. Finned heat sink or coin screw is screwed down to flush

with bottom of lid.

5. BGA device is inserted by aligning A1 position with

chamfered corner of Flip-Top™ socket. Place support

plate on top of device, close lid, engage heat sink or

coin screw, and socket is ready for use.

See page 15 for Generic

Reflow Profiles.

Detailed Installation and General Usage Instructions are

provided with product.

How To Order

1 FR G XXXX - 821 G G XX

Footprint Dash #

If Applicable*

Clamp Options

HS - Heat Sink (3 Fins Std.)

CS - Coin Screw

Model Type

RoHS Compliant Insulator:

FR - Flip-Top™ BGA Socket

Pitch

G = .050/(1.27mm)

H = .039/(1.00mm)

Number of Positions

*See footprints section or

online database.

Contact Plating

RoHS Compliant:

G - Gold

Terminal Plating

RoHS Compliant:

G - Gold

Terminal Type

See options

5 Energy Way, West Warwick, RI 02893 USA

Tel: 800.424.9850 | 401.823.5200

Fax: 401.823.8723

info@advanced.com | www.advanced.com

Catalog 16A

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

inch/(mm)

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