Gas Discharge Tube (GDT) Products
CG/CG2 Series
CG/CG2 Series
Description
®
Littelfuse highly reliable CG/CG2 Series GDTs provide
a high degree of surge protection in a small size ideal
for board level circuit protection.
GDTs function as switches which dissipate a
minimum amount of energy and therefore handle
currents that far surpass other types of transient
voltage protection. Their gas-filled, rugged ceramic
metal construction make them well suited to adverse
environments.
The CG/CG2 series comes in a variety of forms
including surface mount, core, straight and shaped
leads, to serve a variety of mounting methods.
AGENCY FILE NUMBER
Agency Approvals
AGENCY
®
E128662
E320116
The CG Series (75-110V) is ideal for protection of test
and communication equipment and other devices
in which low voltage limits and extremely low arc
voltages are required.
The CG2 Series (145V-1000V) is ideal for protecting
equipment where higher voltage limits and holdover
voltages are necessary.
Features
®
2 Electrode GDT Graphical Symbol
• Rugged Ceramic-Metal
construction
• Low Capacitance
(<1.5pf)
• Meets REA PE-80
• Available in surface
mount, and a variety of
lead options options
Applications
• Communication lines
and equipment
• CATV equipment
• Test equipment
• Data lines
• Power supplies
•
•
•
•
Instrumentation circuits
Medical electronics
ADSL equipment
Telecom SLIC
protection
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
27
Revised: November 10, 2009
CG/CG2 Series
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Electrical Characteristics
Device Specifications
(at 25°C)
DC Breakdown
in Volts
(@100V/s)
Life Ratings
Surge
Life
(@500A
10/1000μs)
Impulse
Break-
down
in Volts
(@100V/μs)
Impulse
Break-
down In
Volts
(@1 Kv/μsec)
Insulation
Capaci-
Arc
Resistance
tance Voltage
(@1MHz)
(on state
Voltage)
@1Amp
Min
Nominal Nominal
AC
DC
Max
Impulse
AC
Dischage Holdover Impulse
Discharge Discharge Current Voltage
2
Discharge
(9 cycle
Current
Current
Current
(8/20μs)
(10x1sec
@50-60Hz)
@50Hz)
(1 Application
@ 10/350μs)
Part
Number
&*
&*
&* 61
&*
&*
&*
&*
&*
&*
&*
&*
&*
&*
MIN
TYP MAX
MAX
MIN
MAX
TYP
TYP
VKRWV
$
$
9
SI
9
VKRWV
VKRWV
$
9
9
N$
&* 61
&* 61
&* 61
&* 61
&* 61
$
N$
&* 61
&* 61
&*
NOTES:
1. Tested to UL1449 Third Edition
2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec.
3. Leaded devices = 5x[5(+) or 5 (-)] applications 20kA 8/20μSec. (75 to 600 volt devices.)
MS and Core devices = 10x[5(+) and 5(-)] applications 10kA 8/20μS (800 to 1000 volt devices.)
Product Characteristics
LS, Axial:
Device: Nickel Plated 2–5 Microns
Lead Wires: Tin Plated 17 ± 12.5 Microns
.5
Construction: Ceramic Insulator
Core:
Device: Tin Plated 17 ± 12.5 Microns.
.5
Construction: Ceramic Insulator
MS:
Device: Dull Tin Plated 7–9 Microns
Construction: Ceramic Insulator
LF Logo, Voltage and date code; Black in
positive print
Glow to arc
transition current
Glow Voltage
Storage and
Operational
Temperature
Maximum Follow
On Current
1
< 0.5Amps
60-160 Volts
-40 to +90
230 Volts r.m.s, 200 Amps.
(800V and 1000V devices tested to UL1449 3rd edition)
Materials
Product Marking
CG/CG2 Series
28
Revised: November 10, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Device Dimensions
Leaded 'L' Type Straight Axial Devices
PROFILE VIEW
0.81
DIA. TYP.
[0.032]
8.10
DIA. MAX.
[0.319]
Leaded 'LS' Type Shaped Lead Devices
PROFILE VIEW
6.07 ± 0.3
[0.239 ± 0.012]
TOP VIEW
TOP VIEW
8.10 Max.
[0.319 DIA Max.]
8.40 ± 0.3
[0.331 ± 0.012]
6.07 ± 0.15
[0.239 ± 0.006]
0.004
62 ± 2
2 Surfaces
9.85 ± 0.30
[0.388 ± 0.012]
11.15 ± 0.30
[0.439 ± 0.012]
0.40 ± 0.03
[0.0157 ± 0.0012]
8.4 ± 0.3
[0.331 ± 0.012]
0.80
[0.032]
Core Devices
SOLDER PAD LAYOUT
9.85
[0.388]
TOP VIEW
8.10 Max.
[0.032 Max.]
PROFILE VIEW
SEMI–PROFILE VIEW
8.60
[0.339]
6.07 ± 0.15
[0.239 ± 0.0059]
5.89
[0.232]
8.10 Max.
1.80
[0.071]
11.65
[0.459]
0.47 ± 0.1
[0.019 ± 0.0039]
'MS' Type Devices
TOP VIEW
8.30 ± 0.1
[0.327 ± 0.0039]
4 ± 0.2
[0.157 ± 0.0079]
PROFILE VIEW
SEMI–PROFILE VIEW
5.58
[0.220]
6.05 ± 0.2
[0.238 ± 0.0079]
ø8.30±0.1
R5.29
[R0.208]
[0
2
9]
0.
7
±
.00
30
0
9.
6 ±
6
.3
0.47 ± 0.1
[0.019 ± 0.0039]
SOLDER PAD LAYOUT
2.29
[0.090]
8.71
[0.343]
5.89
[0.232]
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
29
Revised: November 10, 2009
CG/CG2 Series
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (Min to Max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
T
P
Ramp-up
t
P
Critical Zone
T
L
to T
P
60 – 180 secs
3°C/second max
5°C/second max
217°C
60 – 150 seconds
260
+0/-5
Temperature
200°C
T
L
T
S(max)
Preheat
t
L
Ramp-down
T
S(min)
t
S
25
time to peak temperature
(t 25ºC to peak)
Time
Peak Temperature (T
P
)
Time within
5°C
of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
°C
10 – 30 seconds
6°C/second max
8 minutes Max.
260°C
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature
(°C) - Measured on bottom side of board
280
260
240
220
200
180
160
140
120
100
80
60
40
20
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
10
20
30
40
50
60
70
80
90
0
0
Lead-Free Recommendation
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Solder Pot Temperature:
Solder Dwell Time:
100
°
C
150
°
C
60-180 seconds
280
°
C Maximum
2-5 seconds
Time
(Seconds)
Preheat
Time
Dwell
Time
Cooling
Time
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
CG/CG2 Series
30
Revised: November 10, 2009
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
Gas Discharge Tube (GDT) Products
CG/CG2 Series
Packaging Dimensions
For 'L' Type Axial Lead Items
<1.2 Max. Lead Bend
254.0 - 356.0
[10.0
- 14.0]
<0.8 Max
52.4
[2.063]
22.8
[0.898]
0.0
15]
Direction of Feed
6.4
[0.252]
5.0 Pitch
[0.197]
Core and 'MS' Type Items
275.0
[10.83]
10x4 ± 0.1 = 40
± 0.2
[10
x 0.157 ± 0.004 = 1.575
± 0.008]
0.4 ± 0.05
[0.016 ± 0.002]
1.75 ± 0.1
[0.069 ± 0.004]
1.5 DIA. MAX.
[0.059]
4 ± 0.1
[0.157 ± 0.004]
76.0
[2.99]
100.0
[3.94]
25.0
[0.98]
8.5 ± 0.1
[0.335 ± 0.004]
7.5 ± 0.1
[0.295 ± 0.004]
16 +0.3 / -0.1
[0.630
+0.012 / -0.004]
1.5 DIA. MAX.
[0.059]
17.7
[0.697]
Direction of Feed
8.6 ± 0.1
[0.339 ± 0.004]
12 ± 0.1
[0.472 ± 0.004]
For 'LS' Type Shaped Lead Items
10x4 ± 0.1 = 40
± 0.2
[10x.157
± 0.004 = 1.575
± 0.008]
0.5 ± 0.05
[0.020 ± 0.002]
1.9
[0.075]
1.75 ± 0.1
[0.069 ± 0.004]
1.5 DIA. MAX.
[0.059]
4 ± 0.1
[0.157 ± 0.004]
275.0
[10.82]
100.0
[3.93]
76.0
[2.99]
25.0
[0.98]
11.5 ± 0.1
[0.453 ± 0.004]
24 +0.3 / -0.1
[0.945
+0.019 / -0.004]
25.7
[1.01]
Direction of Feed
11.75 ± 0.1
[0.463 ± 0.004]
8 ± 0.1
[0.315 ± 0.004]
0.5 ± 0.01
[0.020 ± 0.004]
9 ± 0.1
[0.354 ± 0.004]
1.5 DIA. MAX.
[0.059]
16 ± 0.1
[0.630 ± 0.004]
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
31
Revised: November 10, 2009
CG/CG2 Series
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
