Standard Grade, Surface Mount, Solderable
PROTECTIVE
ENCAPSULANT
PRECISION
THIN FILM
RESISTOR
0404 Thin Film Chip Resistor
FEATURES
• Tolerances to ± 0.1%
• Operating temperature range :
-55
°
C to +150
°
C
• For high-density hybrid circuits
where space is at a premium
99.6% ALUMINA CHIP
• TCR's to ± 25 ppm
• Made with the same materials and
process as our MIL-PRF-55342 "S"
level qualified chips
• Delivers greater power handling capability
with lighter weight construction
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
5W-200KW
0.1%, 0.25%, 0.5%, 1%, 2%, 5%, 10%
75 mW
40 Volts
CURRENT NOISE
POWER DISSIPATION
ENVIRONMENTAL PERFORMANCE (1)
TCR (-55 to +125
°
C in ppm/
°
C)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life
< 25 ppm
±0.02%
±0.02%
±0.02%
±0.02%
±0.03%
±0.03%
See Chart
TYPICAL LIFE TEST PERFORMANCE
POWER DERATING
(1) Typical resistance change, the maximum is the same
as MIL-PRF-55342. Test methods are per MIL-PRF-55342.
PART NUMBERING
S0404AA 150 J H W
Termination Material
W: Gold B: Pretinned Solder over Nickel
TCR
E: ±25 ppm H: ±50 ppm K: ±100 ppm
TOLERANCES
B: 0.1% C: 0.25% D: 0.5% F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE
Three or four digits are used with all leading digits significant. Four digits
are used for 1% tolerance or lower, otherwise three digits are used. The last
digit specifies the number of zeros to add. The letter "R" is used to
represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
Substrate Matieral A: Alumina Ceramic
Termination Style A: Top sided with Bottom Isolated C: Wraparound
MECHANICAL
Length
Width
Thickness
Top Term.
INCHES
.040 (+.002/-.002)
.040 (+.002/-.002)
.009 - .011
.006 - .008
MM
1.02 (+.05/-.05)
1.02 (+.05/-.05)
.23 - .27
.15 - .20
Approx. Weight .00110 grams
Solderability: Solder coating compatible with Sn60, 62 or
63 solders, provides good wetting with all types of solder
attachment. All product is tested IAW Mil-Std-202,
method 208, including 8 hour steam aging.
PACKAGING
Two packaging options are available:
• Bulk Packaging - (5000 per Bag Max.)
• Waffle Pack - (400 per Tray Max.)
OPTIONS
SOTA offers a full line of component parts in the 0404 size
including High-Reliability (customer specified testing).
Available options are epoxy bondable and wire bondable
terminations, and custom part marking.
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714
Toll Free 1-800-458-3401
08/08/00
Where Quality Isn't a Goal...It's Our Tradition
DSP and ARM Processors
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