EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K12G560MP-W

Description
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 560ohm, 50V, 10% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP
File Size150KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Download Datasheet Parametric View All

M55342K12G560MP-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 560ohm, 50V, 10% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP

M55342K12G560MP-W Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1916006554
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
YTEOL9.8
structureChip
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.46 mm
Package length1.58 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.81 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance560 Ω
Resistor typeFIXED RESISTOR
size code0603
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance10%
Operating Voltage50 V
State of the Art, Inc.
Thick Film Chip Resistor
M55342/12 RM0603
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
100 mW
50 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 12 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /12 = RM0603
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.092
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.062 (.058 - .070)
.032 (.027 - .037)
.018 (.010 - .033)
.010 (.007 - .017)
.014 (.010 - .020)
.034 (.030 - .038)
.00235 grams
1.58
0.81
0.46
0.25
0.36
0.86
(1.47 - 1.78)
(0.69 - 0.94)
(0.25 - 0.84)
(0.18 - 0.43)
(0.25 - 0.51)
(0.76 - 0.97)
.034
.030
.031
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
MicroPython Hands-on (11) - Building the IDE environment for the control board
In order to lay a solid foundation and systematically learn MicroPython, I bought two control boards.This content is originally created by EEWORLD forum user eagler8 . If you want to reprint or use it...
eagler8 MicroPython Open Source section
[Blood Oximeter] Disassembly Part 2: Introduction to the accessories
After the first unboxing introduction This article mainly introduces attachments.Product CertificateProduct BrochureProduct BrochureProduct BrochureProduct BrochureProduct BrochureProduct BrochureProd...
yichun417 Making friends through disassembly
What should we talk about when we talk about Tesla incident
Tesla's car quality problems have been exposed many times, including spontaneous combustion, explosion, loss of control, water leakage, screen freeze, failure to start after power failure, camera fail...
vayo123 Automotive Electronics
How to Improve Heat Dissipation Using PCB Design
[align=left][color=rgb(51, 51, 51)][/color][/align][align=left][color=rgb(73, 73, 73)][font=微软雅黑][size=4]For electronic devices, a certain amount of heat will be generated during operation, causing th...
ohahaha PCB Design
Why don't all Android phones use Type-C ports?
[size=4] Mobile phones have been developed for decades since their appearance. The charging interface on mobile phones has also changed from the previous single charging function to the mobile phone d...
灞波儿奔 Analogue and Mixed Signal
Live Registration | Building a Sensor-Based Test System Using CompactDAQ and LabVIEW
Live Registration | Building a Sensor-Based Test System Using CompactDAQ and LabVIEWLive broadcast timeJuly 13 (Tuesday) 10:00How to RegisterScan the QR code below to register on your mobile phone:Liv...
EEWORLD社区 Sensor

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号