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CLF201025R51%50PPM/KKB8

Description
Fixed Resistor, Metal Glaze/thick Film, 0.5W, 25.5ohm, 300V, 1% +/-Tol, 50ppm/Cel, 2010,
CategoryPassive components    The resistor   
File Size100KB,2 Pages
ManufacturerMicrotech GmbH Electronic
Environmental Compliance
Download Datasheet Parametric View All

CLF201025R51%50PPM/KKB8 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 25.5ohm, 300V, 1% +/-Tol, 50ppm/Cel, 2010,

CLF201025R51%50PPM/KKB8 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid998894386
Reach Compliance Codecompliant
Country Of OriginGermany
ECCN codeEAR99
YTEOL7
structureChip
JESD-609 codee3
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.625 mm
Package length5 mm
Package formSMT
Package width2.5 mm
method of packingBlister Pack
Rated power dissipation(P)0.5 W
resistance25.5 Ω
Resistor typeFIXED RESISTOR
seriesCLF
size code2010
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Tolerance1%
Operating Voltage300 V
microtech GmbH electronic Teltow
Chip resistors - Made in Germany
High power series
Type: CLF
Sizes: 1210, 1218, 2010, 2512
Characteristics:
Chip resistors in thick film technology
Special layout for high electrical load
Resistance area coated with glass and varnish passivation
High stability and reliability
Tight tolerances (≥0,5%) – low temperature coefficient (≥50ppm/K)
RoHS-conform and Halogen-free according to IEC 61249-2-21 / IPC 4101B
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
Electroplated pure tin
Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after date code)
Epoxy bondable contact -K
Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
ISO 9001:2015
ISO 14001:2015
Dimensions (in mm):
Size
L
Length
Min
Max
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
front
Min
Max
1210
1218
2010
2512
3,00
3,00
4,80
6,10
3,30
3,30
5,20
6,50
2,35
4,50
2,30
3,00
2,65
4,80
2,70
3,30
0,50
0,50
0,50
0,50
0,75
0,75
0,75
0,75
0,35
0,35
0,35
0,35
0,85
0,85
0,85
0,85
0,25
0,25
0,25
0,25
0,85
0,85
0,85
0,85
Packaging units:
Reel
Ø
180 mm
330 mm
Samples on request
Card tape
acc. EN 60286-3
5 T pcs.
10 T pcs.
20 T pcs.
4 T pcs.
8 T pcs.
16 T pcs.
Blister tape
Ordering information:
CLF
Type
CLF
-N
Contact
Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
-S (corrosive gas
resistant)
1210
Size
1210
.
100k
1%
100ppm/K
±
TCR
50
100
K
Marking
K- only with
P
Packaging
P- Card tape
B- Blister
tape
S- Bulk
5
(optional)
R-
±
Tolerance
Value
1R
.
pcs. / Reel
(T pcs.)
Depends on
size and
packaging
unit
to
.
to
.
0,5
1
5
2512
10M
Page 26
Revision: 25-Nov-19
Catalog microtech GmbH electronic

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