8KX8 SPI BUS SERIAL EEPROM, PDSO8, LEAD FREE AND HALOGEN FREE, SOIC-8
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Rochester Electronics |
Parts packaging code | SOIC |
package instruction | LEAD FREE AND HALOGEN FREE, SOIC-8 |
Contacts | 8 |
Reach Compliance Code | unknown |
Maximum clock frequency (fCLK) | 1 MHz |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
length | 4.9 mm |
memory density | 65536 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Humidity sensitivity level | NOT SPECIFIED |
Number of functions | 1 |
Number of terminals | 8 |
word count | 8192 words |
character code | 8000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 8KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | COMMERCIAL |
Maximum seat height | 1.75 mm |
Serial bus type | SPI |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 1.8 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms |
Base Number Matches | 1 |
CAT25C64VI-1.8 | CAT25C64LI | CAT25C64STE13 | CAT25C64S-TE13 | CAT25C64VI | CAT25C64S | CAT25C64V | CAT25C64SI | |
---|---|---|---|---|---|---|---|---|
Description | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, LEAD FREE AND HALOGEN FREE, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDIP8, LEAD FREE AND HALOGEN FREE, PLASTIC, DIP-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, LEAD FREE AND HALOGEN FREE, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, LEAD FREE AND HALOGEN FREE, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 |
Is it lead-free? | Lead free | Lead free | Contains lead | Contains lead | Lead free | Contains lead | Lead free | Contains lead |
Is it Rohs certified? | conform to | conform to | incompatible | incompatible | conform to | incompatible | conform to | incompatible |
Parts packaging code | SOIC | DIP | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
package instruction | LEAD FREE AND HALOGEN FREE, SOIC-8 | LEAD FREE AND HALOGEN FREE, PLASTIC, DIP-8 | SOIC-8 | SOIC-8 | SOP, | SOIC-8 | LEAD FREE AND HALOGEN FREE, SOIC-8 | SOIC-8 |
Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum clock frequency (fCLK) | 1 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz |
JESD-30 code | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609 code | e3 | e3 | e0 | e0 | e3 | e0 | e3 | e0 |
length | 4.9 mm | 9.59 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | SOP | SOP | SOP | SOP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
Peak Reflow Temperature (Celsius) | 260 | 260 | 240 | 240 | 260 | 240 | 260 | 240 |
Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Maximum seat height | 1.75 mm | 4.57 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
Minimum supply voltage (Vsup) | 1.8 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | MATTE TIN | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN | TIN LEAD | MATTE TIN | TIN LEAD |
Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 40 | 40 | 30 | 30 | 40 | 30 | 40 | 30 |
width | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
Maker | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Humidity sensitivity level | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |