8KX8 SPI BUS SERIAL EEPROM, PDSO8, LEAD FREE AND HALOGEN FREE, SOIC-8
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Rochester Electronics |
| Parts packaging code | SOIC |
| package instruction | LEAD FREE AND HALOGEN FREE, SOIC-8 |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| Maximum clock frequency (fCLK) | 3 MHz |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e3 |
| length | 4.9 mm |
| memory density | 65536 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | NOT SPECIFIED |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | COMMERCIAL |
| Maximum seat height | 1.75 mm |
| Serial bus type | SPI |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | MATTE TIN |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3.9 mm |
| Maximum write cycle time (tWC) | 10 ms |
| CAT25C64V | CAT25C64VI-1.8 | CAT25C64LI | CAT25C64STE13 | CAT25C64S-TE13 | CAT25C64VI | CAT25C64S | CAT25C64SI | |
|---|---|---|---|---|---|---|---|---|
| Description | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, LEAD FREE AND HALOGEN FREE, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, LEAD FREE AND HALOGEN FREE, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDIP8, LEAD FREE AND HALOGEN FREE, PLASTIC, DIP-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, LEAD FREE AND HALOGEN FREE, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 | 8KX8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 |
| Is it lead-free? | Lead free | Lead free | Lead free | Contains lead | Contains lead | Lead free | Contains lead | Contains lead |
| Is it Rohs certified? | conform to | conform to | conform to | incompatible | incompatible | conform to | incompatible | incompatible |
| Parts packaging code | SOIC | SOIC | DIP | SOIC | SOIC | SOIC | SOIC | SOIC |
| package instruction | LEAD FREE AND HALOGEN FREE, SOIC-8 | LEAD FREE AND HALOGEN FREE, SOIC-8 | LEAD FREE AND HALOGEN FREE, PLASTIC, DIP-8 | SOIC-8 | SOIC-8 | SOP, | SOIC-8 | SOIC-8 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum clock frequency (fCLK) | 3 MHz | 1 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz | 3 MHz |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e0 | e0 | e3 | e0 | e0 |
| length | 4.9 mm | 4.9 mm | 9.59 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | DIP | SOP | SOP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 240 | 240 | 260 | 240 | 240 |
| Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Maximum seat height | 1.75 mm | 1.75 mm | 4.57 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2.5 V | 1.8 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | MATTE TIN | MATTE TIN | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 30 | 30 | 40 | 30 | 30 |
| width | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| Maker | Rochester Electronics | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Humidity sensitivity level | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD