res 3M ohm 1/20w 5% 0201 smd
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | ROHM Semiconductor |
| package instruction | CHIP |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Other features | STANDARD: TS 16949 |
| structure | Chip |
| JESD-609 code | e3 |
| Installation features | SURFACE MOUNT |
| Number of terminals | 2 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package height | 0.23 mm |
| Package length | 0.6 mm |
| Package shape | RECTANGULAR PACKAGE |
| Package form | SMT |
| Package width | 0.3 mm |
| method of packing | TR, PAPER, 7 INCH |
| Rated power dissipation(P) | 0.05 W |
| Rated temperature | 70 °C |
| Guideline | AEC-Q200 |
| resistance | 3000000 Ω |
| Resistor type | FIXED RESISTOR |
| size code | 0201 |
| surface mount | YES |
| technology | METAL GLAZE/THICK FILM |
| Temperature Coefficient | 250 ppm/°C |
| Terminal surface | Tin (Sn) - with Nickel (Ni) barrier |
| Terminal shape | WRAPAROUND |
| Tolerance | 5% |
| Operating Voltage | 25 V |
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