742X0835110FP datasheet, PDF - EEWORLD Datasheet

742X0835110FP: DescriptionArray/Network Resistor, Isolated, Metal Glaze/thick Film, 0.252W, 511ohm, 50V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 0612, CHIP, ROHS COMPLIANT; CategoryPassive components The resistor; File Size1MB，11 Pages; ManufacturerCTS; Environmental Compliance

Download Datasheet Parametric View All

742X0835110FP Overview

Array/Network Resistor, Isolated, Metal Glaze/thick Film, 0.252W, 511ohm, 50V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 0612, CHIP, ROHS COMPLIANT

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1871682364
package instruction	CHIP, ROHS COMPLIANT
Reach Compliance Code	compliant
Country Of Origin	Japan, Taiwan
ECCN code	EAR99
YTEOL	8.3
structure	Rectangular
Component power consumption	0.063 W
The first element resistor	511 Ω
JESD-609 code	e3
Installation features	SURFACE MOUNT
Network Type	ISOLATED
Number of components	1
Number of functions	4
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package height	0.55 mm
Package length	3.2 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	1.6 mm
method of packing	TR, PAPER, 7 INCH
Rated power dissipation(P)	0.252 W
Rated temperature	70 °C
Guideline	AEC-Q200
resistance	511 Ω
Resistor type	ARRAY/NETWORK RESISTOR
Second/last element resistor	511 Ω
size code	0612
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	200 ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	50 V

[Shanghai Hangxin ACM32F070 development board + touch function evaluation board] Development environment construction and initial experience: refer to Hangxin Data-F070 Development BoardTouch Board Introduction, LCD Board Schematic.rar\ACM32F0x0_FP0X Series Chip Development Quick Start V0.5.pdf Prepare Connect the TYPE-C USB cable to the co...; qinyunti Domestic Chip Exchange

Interim Provisions on the Administration of Micropower (Short-Range) Radio Equipment: Interim Regulations on the Management of Micropower (Short-range) Radio Equipment 　(Ministry of Information Industry, May 1998) Chapter I General Provisions 　　Article 1 In order to promote the healthy...; JasonYoo RF/Wirelessly

520, Give Tang Monk a Wife: Be careful with those who come to your door~ Be careful of being tricked~...; EricGo Talking

[Evaluation of domestic FPGA Gaoyun GW1N series development board]——(1) Development environment: First of all, I would like to thank Eeworld and Anxin for providing the GW1N series development boards. Now, due to the impact of the epidemic and other factors, the shortage of overseas chips and the...; chg0823 Domestic Chip Exchange

DSP code optimization instructions in CCS: [size=4][color=#000000][backcolor=white]The purpose of restrict is to restrict a pointer's access to a block of memory. To put it more concretely, if a memory area is accessed through a restricted poi...; 灞波儿奔 Microcontroller MCU

ACPI Power Management Program: ACPI is the abbreviation of Advanced Configuration and Power Interface, which means "Advanced Configuration and Power Interface". It is a power management standard jointly developed by Intel, Microsof...; zbz0529 Power technology

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components