M55342M09B21D5S-TR datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> M55342M09B21D5S-TR

M55342M09B21D5S-TR: DescriptionFixed Resistor, Metal Glaze/thick Film, 1W, 21.5ohm, 200V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2512, CHIP; CategoryPassive components The resistor; File Size1MB，1 Pages; ManufacturerState of the Art Inc.

Download Datasheet Parametric View All

M55342M09B21D5S-TR Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 21.5ohm, 200V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2512, CHIP

M55342M09B21D5S-TR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1613080161
package instruction	CHIP
Reach Compliance Code	not_compliant
Country Of Origin	USA
ECCN code	EAR99
YTEOL	5.81
Other features	SEMI PRECISION
structure	Rectangular
JESD-609 code	e0
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.71 mm
Package length	6.35 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	3.02 mm
method of packing	TR
Rated power dissipation(P)	1 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342/09
resistance	21.5 Ω
Resistor type	FIXED RESISTOR
size code	2512
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	300 ppm/°C
Terminal surface	Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	200 V

Preview

Download Datasheet

View All

State of the Art, Inc.

Semi-Precision Thick Film Chip Resistor

MIL-PRF-55342/09 Solderable RM2512

1Ω to 22 MΩ

1, 2, 5, 10

100, 200, 300

1000 mW

200 V

-65 to 150°C

M, P, R, S, U, V, T

Noise

Performance

Resistance Range*

Tolerances (± %)*

TCR (± ppm/°C)*

Power Rating

Voltage Rating

Operating Range

Product Levels

Noise (dB)

-20

-40

125

100

1.0

ceramic board

2.0 3.0 4.0

Power (W)

5.0

Power Dissipation

fiber epoxy board

*see QPL55342 for part number availability

Resistance Value (Ω)

Maximum Allowable Drift

Temperature Characteristic

TCR (ppm/°C)

Thermal Shock

Power Conditioning

Low Temperature Operation

Short Time Overload

High Temperature Exposure

Moisture Resistance

Life (Qualification)

Life (FR Level)

Resistance to Soldering Heat

Resistance to Bonding Exposure

±100

±0.5%

±0.25%

±0.5%

±2.0%

±0.25%

±200

±0.5%

±0.25%

±0.5%

±2.0%

±0.25%

±300

±0.5%

±1.0%

±0.5%

±2.0%

±0.25%

0.5

Drift (|%∆R|)

0.4

0.3

0.2

0.1

Life Test

Percent Power

100

Temperature Rise (°C)

Power Derating

4k 6k

Hours

10k

-10

150

Ambient Temperature (°C)

Part Number

M55342K09B100DS -TR

Packaging: -TR: Tape & Reel

Product Level (/1000 hrs.): M: 1%

Resistance Value and Tolerance:

Three numerals and a letter indicating

decimal, value range, and tolerance

-W: Waffle Tray

P: 0.1%

R & U: 0.01%

S & V: 0.001%

T: Space 0.001%

Ω: D: 1% G: 2% J: 5% M: 10%

kΩ: E: 1% H: 2% K: 5% N: 10%

MΩ: F: 1% T: 2% L: 5% P: 10%

Termination Material: B: Solderable (SnPb solder over nickel)

Size: 09: RM2512

Temperature Characteristic (ppm/°C): K: ±100

Performance Specification MIL-PRF-55342

L: ±200

M: ±300

Mechanical

Length (a)

Width (b)

Thickness (c)

Top Termination (d)

Bottom Termination (e)

Approximate Weight

Inches

.250(.244 - .268)

.119(.119 - .129)

.028(.015 - .033)

.020(.015 - .025)

0.05130 g

Millimeters

6.35(6.20 - 6.81)

3.02(3.02 - 3.28)

0.71(0.38 - 0.84)

0.51(0.38 - 0.64)

.300

Recommended

Minimum

Bond Pads

B Termination

Material

(inches)

.049

.202

.125

State of the Art, Inc.

www.resistor.com

Specifications Subject to Change Without Notice

2470 Fox Hill Road, State College, PA, USA 16803-1797

Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714

All Products Made in the USA

Recommended Resources

Off-hook signal detection circuit

The simplest one-way thyristor dimming light circuit

Rotary encoder circuit

4.8MHz oscillation circuit

Computer motherboard circuit diagram 815 1_26

Fax machine circuit diagram 1

Learn more about the application of Xilinx FPGA general-purpose IP cores in communications: The book "Xilinx FPGA Advanced Application: Detailed Explanation and Design and Development of General IP Cores" systematically explains the IP hard cores inside Xilinx FPGA in the field of communicat...; arui1999 Download Centre

MSP430__SD card FAT16 reading and writing program based on MSP430 learning and development system: ######################################################################## Next, let me introduce a SD card FAT16 reading and writing program based on MSP430 learning and development system The basic st...; 火辣西米秀 Microcontroller MCU

C++ (class template inheritance): The searcharray template in the following program inherits the previous freearray template class, and then implements the search operation for specific array elements based on it: //This template inhe...; fish001 Microcontroller MCU

FPGA Memory Recommendations (Using Vivado Design Suite): ...; 至芯科技FPGA大牛 FPGA/CPLD

Compile error 'OCDROM' definition out of range: Seniors, how to solve this problem when compiling?...; 莫道 Renesas Electronics MCUs

Recommend a chip for analog video signal equalization: I want an analog video signal equalization chip, please recommend it. Or if you have experience, please share your experience....; shijizai ADI Reference Circuit

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components