Datasheet
R8C/33C Group
RENESAS MCU
R01DS0008EJ0100
Rev 1.00
Aug. 24, 2010
1.
1.1
Overview
Features
The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/33C Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
R01DS0008EJ0100 Rev 1.00
Aug. 24, 2010
Page 1 of 53
R8C/33C Group
1. Overview
1.1.2
Specifications
Tables 1.1 and 1.2 outline the Specifications for R8C/33C Group.
Table 1.1
Item
CPU
Specifications for R8C/33C Group (1)
Function
Central processing
unit
Specification
R8C CPU core
• Number of fundamental instructions: 89
• Minimum instruction execution time:
50 ns (f(XIN) = 20 MHz, VCC = 2.7 to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 1.8 to 5.5 V)
• Multiplier: 16 bits × 16 bits
→
32 bits
• Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits
→
32 bits
• Operation mode: Single-chip mode (address space: 1 Mbyte)
Refer to
Table 1.3 Product List for R8C/33C Group.
• Power-on reset
• Voltage detection 3 (detection level of voltage detection 0 and voltage
detection 1 selectable)
• Input-only: 1 pin
• CMOS I/O ports: 27, selectable pull-up resistor
• High current drive ports: 27
4 circuits: XIN clock oscillation circuit,
XCIN clock oscillation circuit (32 kHz),
High-speed on-chip oscillator (with frequency adjustment function),
Low-speed on-chip oscillator
• Oscillation stop detection: XIN clock oscillation stop detection function
• Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16
• Low power consumption modes:
Standard operating mode (high-speed clock, low-speed clock, high-speed
on-chip oscillator, low-speed on-chip oscillator), wait mode, stop mode
Real-time clock (timer RE)
• Number of interrupt vectors: 69
• External Interrupt: 7 (INT × 3, Key input × 4)
• Priority levels: 7 levels
• 14 bits × 1 (with prescaler)
• Reset start selectable
• Low-speed on-chip oscillator for watchdog timer selectable
• 1 channel
• Activation sources: 23
• Transfer modes: 2 (normal mode, repeat mode)
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), pulse output mode (output level inverted every
period), event counter mode, pulse width measurement mode, pulse period
measurement mode
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), programmable waveform generation mode (PWM
output), programmable one-shot generation mode, programmable wait one-
shot generation mode
16 bits × 1 (with 4 capture/compare registers)
Timer mode (input capture function, output compare function), PWM mode
(output 3 pins), PWM2 mode (PWM output pin)
8 bits × 1
Real-time clock mode (count seconds, minutes, hours, days of week), output
compare mode
Memory
ROM, RAM, Data
flash
Power Supply Voltage detection
Voltage
circuit
Detection
I/O Ports
Programmable I/O
ports
Clock
Clock generation
circuits
Interrupts
Watchdog Timer
DTC (Data Transfer Controller)
Timer
Timer RA
Timer RB
Timer RC
Timer RE
R01DS0008EJ0100 Rev 1.00
Aug. 24, 2010
Page 2 of 53
R8C/33C Group
1. Overview
Table 1.2
Item
Serial
Interface
Specifications for R8C/33C Group (2)
Function
UART0, UART1
UART2
Specification
Clock synchronous serial I/O/UART × 2 channel
Clock synchronous serial I/O/UART, I
2
C mode (I
2
C-bus),
multiprocessor communication function
1 (shared with I
2
C-bus)
1 (shared with SSU)
Hardware LIN: 1 (timer RA, UART0)
10-bit resolution × 12 channels, includes sample and hold function, with sweep
mode
8-bit resolution × 2 circuits
2 circuits
• Programming and erasure voltage: VCC = 2.7 to 5.5 V
• Programming and erasure endurance: 10,000 times (data flash)
1,000 times (program ROM)
• Program security: ROM code protect, ID code check
• Debug functions: On-chip debug, on-board flash rewrite function
• Background operation (BGO) function
f(XIN) = 20 MHz (VCC = 2.7 to 5.5 V)
f(XIN) = 5 MHz (VCC = 1.8 to 5.5 V)
Typ. 6.5 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
Typ. 3.5 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 3.5
µA
(VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz))
Typ. 2.0
µA
(VCC = 3.0 V, stop mode)
-20 to 85°C (N version)
-40 to 85°C (D version)
(1)
32-pin LQFP
Package code: PLQP0032GB-A (previous code: 32P6U-A)
Synchronous Serial
Communication Unit (SSU)
I
2
C bus
LIN Module
A/D Converter
D/A Converter
Comparator B
Flash Memory
Operating Frequency/Supply
Voltage
Current Consumption
Operating Ambient Temperature
Package
Note:
1. Specify the D version if D version functions are to be used.
R01DS0008EJ0100 Rev 1.00
Aug. 24, 2010
Page 3 of 53
R8C/33C Group
1. Overview
1.2
Product List
Table 1.3 lists Product List for R8C/33C Group, and Figure 1.1 shows a Part Number, Memory Size, and Package
of R8C/33C Group.
Table 1.3
Product List for R8C/33C Group
ROM Capacity
Program ROM
Data flash
4 Kbytes
1 Kbyte
×
4
8 Kbytes
1 Kbyte
×
4
16 Kbytes
1 Kbyte
×
4
24 Kbytes
1 Kbyte
×
4
32 Kbytes
1 Kbyte
×
4
4 Kbytes
1 Kbyte
×
4
8 Kbytes
1 Kbyte
×
4
16 Kbytes
1 Kbyte
×
4
24 Kbytes
1 Kbyte
×
4
32 Kbytes
1 Kbyte
×
4
RAM
Capacity
512 bytes
1 Kbyte
1.5 Kbytes
2 Kbytes
2.5 Kbytes
512 bytes
1 Kbyte
1.5 Kbytes
2 Kbytes
2.5 Kbytes
Current of Aug 2010
Package Type
Remarks
Part No.
R5F21331CNFP
R5F21332CNFP
R5F21334CNFP
R5F21335CNFP
R5F21336CNFP
R5F21331CDFP
R5F21332CDFP
R5F21334CDFP
R5F21335CDFP
R5F21336CDFP
PLQP0032GB-A N version
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A D version
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
Part No.
R 5 F 21 33 6 C N FP
Package type:
FP: PLQP0032GB-A (0.8 mm pin-pitch, 7 mm square body)
Classification
N: Operating ambient temperature -20°C to 85°C
D: Operating ambient temperature -40°C to 85°C
ROM capacity
1: 4 KB
2: 8 KB
4: 16 KB
5: 24 KB
6: 32 KB
R8C/33C Group
R8C/3x Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.1
Part Number, Memory Size, and Package of R8C/33C Group
R01DS0008EJ0100 Rev 1.00
Aug. 24, 2010
Page 4 of 53
R8C/33C Group
1. Overview
1.3
Block Diagram
Figure 1.2 shows a Block Diagram.
8
8
3
5
3
1
I/O ports
Peripheral functions
Timers
Timer RA (8 bits
×
1)
Timer RB (8 bits
×
1)
Timer RC (16 bits
×
1)
Timer RE (8 bits
×
1)
Port P0
Port P1
Port P2
Port P3
Port P4
UART or
clock synchronous serial I/O
(8 bits
×
3)
I
2
C bus or SSU
(8 bits
×
1)
System clock generation
circuit
XIN-XOUT
High-speed on-chip oscillator
Low-speed on-chip oscillator
XCIN-XCOUT
LIN module
Watchdog timer
(14 bits)
Comparator B
A/D converter
(10 bits
×
12 channels)
D/A converter
(8 bits
×
2)
Voltage detection circuit
Low-speed on-chip oscillator
for watchdog timer
DTC
R8C CPU core
R0H
R1H
R2
R3
A0
A1
FB
R0L
R1L
SB
USP
ISP
INTB
PC
FLG
Memory
ROM
(1)
RAM
(2)
Multiplier
Notes:
1. ROM size varies with MCU type.
2. RAM size varies with MCU type.
Figure 1.2
Block Diagram
R01DS0008EJ0100 Rev 1.00
Aug. 24, 2010
Page 5 of 53
京公网安备 11010802033920号
EEWORLD
