|
ZL30116GGGV2 |
ZL30116GGG2V2 |
Description |
IC sonet/sdh synch 100cabga |
IC sonet/sdh synch 100cabga |
Maker |
Microsemi |
Microsemi |
Parts packaging code |
BGA |
BGA |
package instruction |
FBGA, |
FBGA, |
Contacts |
100 |
100 |
Reach Compliance Code |
compli |
compli |
JESD-30 code |
S-PBGA-B100 |
S-PBGA-B100 |
length |
9 mm |
9 mm |
Number of functions |
1 |
1 |
Number of terminals |
100 |
100 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
FBGA |
FBGA |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
GRID ARRAY |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.72 mm |
1.72 mm |
Nominal supply voltage |
3.3 V |
1.8 V |
surface mount |
YES |
YES |
Telecom integrated circuit types |
ATM/SONET/SDH SUPPORT CIRCUIT |
ATM/SONET/SDH SUPPORT CIRCUIT |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
width |
9 mm |
9 mm |