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MC0.0625W04021%3M01FR

Description
RESISTOR, METAL GLAZE/THICK FILM, 0.0625W, 1%, 100ppm, 3010000ohm, SURFACE MOUNT, 0402, CHIP
CategoryPassive components    The resistor   
File Size639KB,29 Pages
ManufacturerSPC Multicomp
Download Datasheet Parametric View All

MC0.0625W04021%3M01FR Overview

RESISTOR, METAL GLAZE/THICK FILM, 0.0625W, 1%, 100ppm, 3010000ohm, SURFACE MOUNT, 0402, CHIP

MC0.0625W04021%3M01FR Parametric

Parameter NameAttribute value
Objectid1302862157
package instructionCHIP
Reach Compliance Codeunknown
ECCN codeEAR99
structureRectangular
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.35 mm
Package length1 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.5 mm
method of packingTR
Rated power dissipation(P)0.0625 W
Rated temperature70 °C
resistance3010000 Ω
Resistor typeFIXED RESISTOR
size code0402
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTIN OVER NICKEL
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage50 V
Thick Film Chip Resistor
0402
Features
Small size and light weight
Suitable for both wave and reflow soldering
Reduction of assembly costs
Performance Specification
Temperature Coefficient
Short Time Overload
Insulation Resistance
Dielectric Withstanding Voltage
Terminal Bending
Soldering Heat
Solderability
Temperature Cycling
Humidity (Steady State)
Load Life in Humidity
Load Life
: 1Ω to 10Ω ±400PPM/°C
11Ω to 100Ω ±200PPM/°C
>100Ω ±100PPM/°C
: ±5% : ±(2% +0.1Ω)Max.
±1% : ±(1% +0.1Ω)Max.
: Min. 1,000MΩ
: No evidence of flashover, mechanical damage,
arcing or insulation breakdown.
: ±(1% +0.05Ω) Max.
: ±(1% +0.05Ω) Max.
: Min. 95% coverage
: ±5% : ±(1% +0.05Ω) Max.
±1% : ±(0.5% +0.05Ω) Max.
: ±5% : ±(3% +0.1Ω) Max.
±1% : ±(0.5% +0.1Ω) Max.
: ±5% : ±(3% +0.1Ω) Max.
±1% : ±(1% +0.1Ω) Max.
: ±5% : ±(3% +0.1Ω) Max.
±1% : ±(1% +0.1Ω) Max.
Derating Curve
www.element14.com
www.farnell.com
www.newark.com
Page <1>
04/06/13
V1.0
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