EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

C1808H209BGGALT500

Description
Ceramic Capacitor, Multilayer, Ceramic, 2000V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000002uF, Surface Mount, 1808, CHIP
CategoryPassive components    capacitor   
File Size214KB,1 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

C1808H209BGGALT500 Overview

Ceramic Capacitor, Multilayer, Ceramic, 2000V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000002uF, Surface Mount, 1808, CHIP

C1808H209BGGALT500 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1598927182
package instruction, 1808
Reach Compliance Codecompliant
YTEOL5.81
capacitance0.000002 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.6 mm
JESD-609 codee0
length4.7 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5%
Number of terminals2
Maximum operating temperature200 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, Embossed Plastic, 7 Inch
positive tolerance5%
Rated (DC) voltage (URdc)2000 V
size code1808
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width2 mm
Application example of using 555 to realize timing function
[size=4][color=#000000][backcolor=white]1. The 555 chip can realize accurate timing function. In the delay mode, the external resistor and capacitor can realize relatively accurate timing. [/backcolor...
灞波儿奔 Microcontroller MCU
How does TI's battery management chip complete the development process and obtain mass production documents?
[i=s]This post was last edited by qwqwqw2088 on 2020-5-28 08:19[/i]The development steps mainly include: 1. Configuration parameters 2. Calibration 3. Cell curve CHEM-ID selection 4. Golden learning 5...
qwqwqw2088 Analogue and Mixed Signal
【Mil MYX-1028X】(IV) Network Communication Demo
【Mil MYX-1028X】(IV) Network Communication Demo 1. Network communication function 1.1 Case function Demo application comes from Chuanglong Technology This case mainly implements the text data sending a...
小火苗 NXP MCU
Today's live broadcast at 10:00: Introduction to ST machine learning, bone vibration, and SensorTile.box sensor development kit
Click here to view the live broadcast replayLive broadcast time: 10:00-11:30 this morningLive broadcast topic: Introduction to ST MEMS sensor development kitLive broadcast content:The live broadcast i...
nmg MEMS sensors
Network Camera Data/Port Forwarding Hardware Design Solution
BOSS made the following request, giving up the solution. I am relatively unfamiliar with IPC, so I came to the forum to seek the opinions of forum friends. The requirements are as follows: Note: IPC i...
电子微创意 Security Electronics
[Comic] Confession of a PCB layout engineer!
[b]【Cartoon】Confession of a PCB layout engineer! [/b][align=center][color=rgb(51, 51, 51)][font=-apple-system-font, BlinkMacSystemFont, "][size=17px][/size][/font][/color][/align][p=24, null, left][co...
btty038 PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号