EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

L111S560JM2

Description
Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.125W, 56ohm, 100V, 5% +/-Tol, -250,250ppm/Cel,
CategoryPassive components    The resistor   
File Size61KB,5 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

L111S560JM2 Overview

Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.125W, 56ohm, 100V, 5% +/-Tol, -250,250ppm/Cel,

L111S560JM2 Parametric

Parameter NameAttribute value
Objectid910564058
Reach Compliance Codecompliant
Country Of OriginJapan
ECCN codeEAR99
YTEOL7.25
structureConformal Coated
Lead length3.556 mm
lead spacing2.54 mm
Network TypeBussed
Number of terminals11
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package height4.95 mm
Package length27.94 mm
Package formSIP
Package width2.41 mm
method of packingTube
Rated power dissipation(P)0.125 W
resistance56 Ω
Resistor typeARRAY/NETWORK RESISTOR
seriesL(BUSSED,5%)
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient250 ppm/°C
Tolerance5%
Operating Voltage100 V
TLP3547 Evaluation--Design Application Comparison
I was on the last list of people who passed the test. When I received this module, I had already seen many tests online, which basically covered the performance and characteristics of this module. I h...
fsyicheng Toshiba Photorelays TLP3547 Review
【AT-START-F425 Review】USB to CAN Part 2
[i=s]This post was last edited by lugl4313820 on 2022-4-14 22:26[/i]My starter project is based on the RT_Thread CAN project. 1. Add the USB project driver to the original basic project: Copy the thre...
lugl4313820 Domestic Chip Exchange
Bluetooth protocol specifications (RF, baseband link control, link management)
[align=left] [/align][align=left] [/align][align=left]The Bluetooth protocol is the rule that Bluetooth devices should follow when exchanging information. Like the Open System Interconnection (OSI) mo...
freebsder RF/Wirelessly
Some methods to make mobile power pass EMI test
[i=s]This post was last edited by qwqwqw2088 on 2019-1-14 08:32[/i] [align=left][font="][size=4][color=#000000][backcolor=white] A key design challenge in designing a mobile power bank is passing the ...
qwqwqw2088 Analogue and Mixed Signal
How to lock the state machine diagram in IAR Visualstate to prevent modification
How to lock the state machine diagram set by IAR Visualstate to prevent modification, that is, not allowing editing of the set state machine....
mllen858585 Embedded System
My Journey of MCU Development (VIII)
"The wind is whistling, the horses are neighing!" Although I don't have to face other people's cold faces because of my low technology in recent years. But the fierce winds and waves in the world also...
bigbat Talking about work

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号