EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-13G-186-C1-R0

Description
heatsink 40x40x35mm R-tab
CategoryThermal management products   
File Size343KB,1 Pages
ManufacturerAll Sensors
Environmental Compliance  
Download Datasheet Parametric View All

ATS-13G-186-C1-R0 Overview

heatsink 40x40x35mm R-tab

ATS-13G-186-C1-R0 Parametric

Parameter NameAttribute value
Datasheets
ATS-13G-186-C1-R0
Standard Package1
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeTop Mou
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodPush Pi
ShapeSquare, Fins
Length1.575" (40.01mm)
Width1.575" (40.00mm)
Diamete-
Height Off Base (Height of Fin)1.378" (35.00mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow2.77°C/W @ 100 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlue Anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-13G-186-C1-R0
Description:
pushPIN™ HS ASMBLY,COARSE-PITCH,STRAIGHT, HOLE PATTERN:RIGHT-TABBED,BLUE,NO TIM
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-CPX040040035-186-C1-R0
Push Pin:
Springs:
ATS-PP-08
ATS-PPS-13
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
2.77
1.74
200
(1.0)
1.68
1.30
300
(1.5)
1.37
1.11
400
(2.0)
1.20
1.00
500
(2.5)
1.09
0.92
600
(3.0)
1.01
0.86
700
(3.5)
0.95
0.82
Fin
Pitch
COARSE-
PITCH
Fin
Type
STRAIGHT
Hole
Pattern
RIGHT-
TABBED
Product Detail
P/N
ATS-13G-186-C1-R0
A
40.00
Dimensions
B
C
E
40.00
35.00
45.00
F
45.00
NOTES:
Push Pin
ATS-PP-08
Spring
ATS-PPS-13
TIM
NO TIM
Finish
BLUE ANODIZED
For Illustration Purposes ONLY.
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction
of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice
to improve the design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
How to use PIC microcontroller memory bank 0 or 1
The data memory of the intermediate product PIC16C6X of PIC microcontroller is usually divided into two banks, namely, bank 0 (Bank0) and bank 1 (Bank1). Each bank consists of two parts: dedicated reg...
rain Microchip MCU
Code statistics of the most popular programming languages on GitHub
...
dcexpert MicroPython Open Source section
This is a good comprehensive DC information that I have personally read
DC Comprehensive Information...
阳光1224 EE_FPGA Learning Park
[Allwinner V853 heterogeneous AI intelligent vision development board evaluation] Cross-compilation environment settings and applications
After setting the system environment variables, you only need to enter arm-openwrt-linux-gcc in the Linux terminal to call the cross compiler. There are 3 ways to set the system environment variables:...
dql2016 Domestic Chip Exchange
LM2776 output voltage is abnormal
I use LM2776 to generate -5V voltage. The problem now is that after power on, the output voltage of the place where -5V should be output is 0.67V; but after touching the -5 output pin with an oscillos...
风陵渡12138 Power technology
Comment to win a 50-yuan Jingdong card! Watch the video to learn how to use a mixed signal oscilloscope to explore bus and protocol analysis
The excellent design of the MSO6B series is oriented towards higher-speed embedded designs, meeting users' needs for mixed-signal design debugging and the ever-increasing serial bus speed. Provide cut...
EEWORLD社区 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号