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DS-808-4TNC

Description
20MHz - 2000MHz RF/MICROWAVE SPLITTER, 3dB INSERTION LOSS, C-18
CategoryWireless rf/communication    Radio frequency and microwave   
File Size135KB,2 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
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DS-808-4TNC Overview

20MHz - 2000MHz RF/MICROWAVE SPLITTER, 3dB INSERTION LOSS, C-18

DS-808-4TNC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTE Connectivity
Reach Compliance Codeunknown
Other featuresTNC, ISOLATION-MIN (DB):20
Characteristic impedance50 Ω
structureCOAXIAL
Maximum input power (CW)36.99 dBm
Maximum insertion loss3 dB
Maximum operating frequency2000 MHz
Minimum operating frequency20 MHz
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
RF/Microwave Device TypesSPLITTER
Maximum voltage standing wave ratio2
Base Number Matches1

DS-808-4TNC Related Products

DS-808-4TNC DS-808-4 DS-808-4SMA DS-808-4N DS-808-4BNC
Description 20MHz - 2000MHz RF/MICROWAVE SPLITTER, 3dB INSERTION LOSS, C-18 20MHz - 2000MHz RF/MICROWAVE SPLITTER, 3dB INSERTION LOSS 20MHz - 2000MHz RF/MICROWAVE SPLITTER, 3dB INSERTION LOSS, C-18 20MHz - 2000MHz RF/MICROWAVE SPLITTER, 3dB INSERTION LOSS, C-18 20MHz - 2000MHz RF/MICROWAVE SPLITTER, 3dB INSERTION LOSS, C-18
Maker TE Connectivity TE Connectivity TE Connectivity TE Connectivity TE Connectivity
Reach Compliance Code unknown unknown unknown unknown unknown
Characteristic impedance 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω
Maximum input power (CW) 36.99 dBm 36.99 dBm 36.99 dBm 36.99 dBm 36.99 dBm
Maximum insertion loss 3 dB 3 dB 3 dB 3 dB 3 dB
Maximum operating frequency 2000 MHz 2000 MHz 2000 MHz 2000 MHz 2000 MHz
Minimum operating frequency 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C
RF/Microwave Device Types SPLITTER SPLITTER SPLITTER SPLITTER SPLITTER
Maximum voltage standing wave ratio 2 2 2 2 2
Is it Rohs certified? incompatible - incompatible incompatible incompatible
Other features TNC, ISOLATION-MIN (DB):20 - SMA, ISOLATION-MIN (DB):20 N, ISOLATION-MIN (DB):20 BNC, ISOLATION-MIN (DB):20
structure COAXIAL - COAXIAL COAXIAL COAXIAL
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