EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-T0303GG-03-2461-BG

Description
Array/Network Resistor, Center Tap, Thin Film, 0.25W, 2460ohm, 100V, 0.1% +/-Tol, -25,25ppm/Cel, 0303,
CategoryPassive components    The resistor   
File Size376KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

WBC-T0303GG-03-2461-BG Overview

Array/Network Resistor, Center Tap, Thin Film, 0.25W, 2460ohm, 100V, 0.1% +/-Tol, -25,25ppm/Cel, 0303,

WBC-T0303GG-03-2461-BG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid802693322
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
Network TypeCenter Tap
Number of terminals6
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package length0.762 mm
Package formSMT
Package width0.762 mm
method of packingTray
Rated power dissipation(P)0.25 W
resistance2460 Ω
Resistor typeARRAY/NETWORK RESISTOR
seriesWBC(TAPPED)
size code0303
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Tolerance0.1%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC Advanced Film Division
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
R
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
Passivation
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Gold available)
Gold
3KÅ minimum
Silicon Dioxide or
Silicon Nitride
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
R
Top contact
pad chamfered
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
Backside
½R
½R
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue April 2006
[Non-contact automatic disinfection system] Material unpacking - a little surprise
After a long wait, I finally received the materials I had been waiting for! ! ! (The twists and turns will be explained in the next article)I received a big box by courier. I was surprised to see so m...
tianshuihu DigiKey Technology Zone
>>See here "New Trend Report: How to Effectively Respond to Current Challenges in the Field of Test and Measurement" and download to win prizes!
Download "New Trend Report: How to Effectively Meet the Challenges in Current Test and Measurement Fields" to win prizes! With the rise of cutting-edge technologies such as 5G, new energy vehicles and...
EEWORLD社区 Integrated technical exchanges
itop4412 development board-QtE4.7-UVC camera usage examples
This document mainly introduces the use process of UVC camera under QtE4.7 system of iTOP-4412 development board.The project file is: "iTOP-4412-QtE4.7-UVC_V1.0" (note the version update). Users can d...
马佳徐徐 Embedded System
Some problems with nested make
[size=4] In some large projects, we will put our source files of different modules or different functions in different directories. We can write a Makefile for each directory, which is helpful to make...
Jacktang DSP and ARM Processors
Doesn't the EK140P have an EIM interface?
[color=#000080]A: We are using the EK140P core board, which is connected to the FPGA through the EIM interface of imx6. A dual-port RAM is built inside the FPGA. [/color] [color=#000080]It is a bit di...
明远智睿Lan Integrated technical exchanges
TIOBE Index October 2022
TIOBE Index October 2022Headline: The dominance of the four major languages continues to increaseFor quite some time, Python, Java, C and C++ were the top four languages in the TIOBE index. They are f...
dcexpert Talking

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号