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M62337P

Description
8-bit 2ch i2c bus D-A converter with buffer amplifiers
CategoryAnalog mixed-signal IC    converter   
File Size38KB,6 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric Compare View All

M62337P Overview

8-bit 2ch i2c bus D-A converter with buffer amplifiers

M62337P Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMitsubishi
Parts packaging codeDIP
package instructionDIP, DIP8,.3
Contacts8
Reach Compliance Codeunknow
Maximum analog output voltage4.9 V
Minimum analog output voltage0.1 V
Converter typeD/A CONVERTER
Enter bit codeBINARY
Input formatSERIAL
JESD-30 codeR-PDIP-T8
JESD-609 codee0
length8.9 mm
Maximum linear error (EL)0.5859%
Number of digits8
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height4.5 mm
Maximum slew rate2.5 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
MITSUBISHI <STD. LINEAR ICs>
M62332P/FP
M62337P/FP
8-BIT 2CH I
2
C BUS D-A CONVERTER WITH BUFFER AMPLIFIERS
DESCRIPTION
The M62332/M62337 is an integrated circuit
semiconductor of CMOS structure with 2 channels of built
in D-A converters with output buffer operational amplifiers.
The input is 2-wires serial method is used for the transfer
format of digital data to allow connection with a
microcomputer with minimum wiring.
The output buffer operational amplifier employs AB class
output circuit with sync and source drive capacity of 1.0mA
or more,and it operates in the whole voltage range from
Vcc to ground.
The M62332 and the M62337 differ only in their slave
address.
PIN CONFIGURATION(TOP VIEW)
Ao1 1
8 Vcc
M62332
M62337
Ao2 2
N.C. 3
N.C. 4
7 SCL
6 SDA
5 GND
Outline 8P4 (P)
8P2S-A (FP)
FEATURES
Digital data transfer format
I
2
C BUS serial data method
Output buffer operational amplifier
it operates in the whole voltage range from Vcc to
ground.
N.C.:NO CONNECTION
High output current drive capacity
±1.0mA over
APPLICATION
Conversion from digital data to analog control data for
home-use and industrial equipment.
Signal gain control or automatic adjustment of DISPLAY-
MONITOR or CTV.
BLOCK DIAGRAM
Vcc
8
SCL
7
SDA
6
GND
5
POWER ON
RESET
I
2
C BUS TRANSCEIVER
8
CHANNEL
DECODER
8bit Latch
8bit upper
segment R-2R
8bit Latch
8bit upper
segment R-2R
1
2
Ao1
Ao2
MITSUBISHI ELECTRIC
980714 rev.F ( 1 / 6 )

M62337P Related Products

M62337P M62337FP
Description 8-bit 2ch i2c bus D-A converter with buffer amplifiers 8-bit 2ch i2c bus D-A converter with buffer amplifiers
Is it Rohs certified? incompatible incompatible
Maker Mitsubishi Mitsubishi
Parts packaging code DIP SOIC
package instruction DIP, DIP8,.3 SOP, SOP8,.25
Contacts 8 8
Reach Compliance Code unknow unknow
Maximum analog output voltage 4.9 V 4.9 V
Minimum analog output voltage 0.1 V 0.1 V
Converter type D/A CONVERTER D/A CONVERTER
Enter bit code BINARY BINARY
Input format SERIAL SERIAL
JESD-30 code R-PDIP-T8 R-PDSO-G8
JESD-609 code e0 e0
length 8.9 mm 5 mm
Maximum linear error (EL) 0.5859% 0.5859%
Number of digits 8 8
Number of functions 1 1
Number of terminals 8 8
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -20 °C -20 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP
Encapsulate equivalent code DIP8,.3 SOP8,.25
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum seat height 4.5 mm 1.9 mm
Maximum slew rate 2.5 mA 2.5 mA
Nominal supply voltage 5 V 5 V
surface mount NO YES
technology CMOS CMOS
Temperature level OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm 1.27 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 4.4 mm

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