WS256K32N-25G4IA datasheet, PDF

WS256K32N-25G4IA: DescriptionSRAM Module, 256KX32, 25ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68; Categorystorage storage; File Size149KB，7 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WS256K32N-25G4IA Overview

SRAM Module, 256KX32, 25ns, CMOS, CQFP68, 40 MM, HERMETIC SEALED, CERAMIC, QFP-68

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1546168924
package instruction	40 MM, HERMETIC SEALED, CERAMIC, QFP-68
Reach Compliance Code	unknown
Maximum access time	25 ns
Other features	CONFIGURABLE AS 256K X 32
Spare memory width	16
JESD-30 code	S-CQFP-F68
length	39.6 mm
memory density	8388608 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFF
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	39.6 mm

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