YED122 Series
Specifications
PGA
Part Number
(Details)
Insulation Resistance:
10
12
Ω
min.
Withstanding Voltage:
1,000V
RMS
for 1 minute
Contact Resistance:
10mΩ max. at 10mA / 20mV
Current Rating:
1A max.
Operating Temperature Range: -55°C ~ +125°C
Acceptable Pin Diameter:
0.46 ±0.05
Mating Cycles:
100 insertions min.
YED122
Series No.
– 064 10 – 0 B S *
No. of Contact Pins
Grid
Design No.
Inner Contact Plating B = Gold
Outer Sleeve Plating S = Sn over Ni
Terminal Structure
1 = Straight Wire Wrapping Type (L=6.6mm)
2 = Straight Wire Wrapping Type (L=9.5mm)
4 = Straight Solder Dip Type (L=2.9mm)
Materials and Finish
RoHS
Housing: PCT, 30% Polyester, glass filled UL94V-0
Contact: Inner clip – Beryllium Copper (BeCu), Au over Ni (2-3µm)
Outer sleeve – Machined Brass, Sn over Ni (2-3µm)
Features
Round tail production PGA sockets
with Solder Dip or Wire Wrap terminals
Best solder ability due to stand-offs
Low insertion and extraction force,
due to 6 contacting leaves per pin
Any contact pattern available
Grid sizes >22 x 22 on request
Outline Socket Dimensions
Contact Position Detail
Through Hole Terminal
Wire Wrapping Terminal
Through Hole Terminal
2.9
Grid Size
5x5
6x6
7x7
8x8
9x9
10 x 10
11 x 11
12 x 12
13 x 13
14 x 14
15 x 15
17 x 17
18 x 18
19 x 19
20 x 20
21 x 21
22 x 22
Pin Count
25
36
49
49
56
84
96
128
144
160
200
240
288
336
364
441
484
A
12.62
15.16
17.70
20.24
22.78
25.32
27.86
30.40
32.94
35.48
38.02
43.10
45.64
48.18
50.72
53.26
55.80
B
2.54x 4=10.16
2.54x 5=12.70
2.54x 6=15.24
2.54x 7=17.78
2.54x 8=20.32
2.54x 9=22.86
2.54x10=25.40
2.54x11=27.94
2.54x12=30.48
2.54x13=33.02
2.54x14=35.56
2.54x16=40.64
2.54x17=43.18
2.54x18=45.72
2.54x19=48.26
2.54x 20=50.80
2.54x21=53.34
C
–
–
–
10.16
12.70
10.16
12.70
8.89
11.43
13.97
11.43
17.78
15.24
11.43
13.97
–
–
D
–
–
–
–
–
20.32
22.86
25.40
27.94
30.48
33.02
38.10
40.64
43.18
45.72
–
–
Sockets and Connectors
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
Wireless Connectivity
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