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FTG0209-690GGHS

Description
IC Socket, BGA209, 209 Contact(s), Surface Mount
CategoryThe connector    socket   
File Size825KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Environmental Compliance
Download Datasheet Parametric View All

FTG0209-690GGHS Overview

IC Socket, BGA209, 209 Contact(s), Surface Mount

FTG0209-690GGHS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1153513450
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL6.8
Other featuresWITH HEAT SINK
body width0.984 inch
body length0.827 inch
Contact to complete cooperationAU ON NI
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedBGA209
Shell materialGLASS FILLED THERMOPLASTIC
JESD-609 codee4
Manufacturer's serial numberFTG
Plug contact pitch0.05 inch
Installation methodSTRAIGHT
Number of contacts209
Maximum operating temperature260 °C
Minimum operating temperature-60 °C
PCB contact patternRECTANGULAR
Termination typeSURFACE MOUNT
Flip-Top™
Ball Grid Array Sockets
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
How It Works
SMT models are shipped un-assembled to ease solderability.
Thru-hole models are shipped fully assembled.
1. Lower assembly is soldered to PC board with no
external hold-down mechanism. Thru-hole models
may be soldered to PC board or plugged into a
mating socket.
2. Upper assembly inserts easily to lower assembly
by aligning guide posts and installing four (sup-
plied) screws.
3. Finned heat sink or coin screw is screwed down to
flush position.
Support Plate
Not Shown
4. Lid opens easily by pressing latch.
5. BGA device is inserted by aligning A1 position with
chamfered corner of Flip-Top™ socket. Place
support plate on top of device, close lid, engage
heat sink or coin screw, and socket is ready for use.
Detailed Installation and General Usage
Instructions are provided with product.
Flip-Top™ Features
• Designed to save space on new and
existing PC boards in test, develop-
ment, programming and production
applications.
• No external hold-downs or soldering
of BGA device required.
• AIC exclusive eutectic solder ball
terminals offer superior processing.
• Uses same footprint as BGA device.
• Compact design maximizes PCB real
estate – only 3mm wider and 10mm
longer than BGA device package.
• Available with integral, finned heat
sink or coin screw clamp assembly.
• Currently available in 1.27mm pitch.
• Consult factory for additional terminal
styles and heat sink options, as well
as custom designs.
1.27mm Pitch Terminal Options
Standard Terminals
for Test, Development and Production Applications
Terminals for LGA or
De-balled BGA Device Applications
Type -690
Surface Mount
Type -708
Thru-Hole
.183
(4.65)
Type -712
.193
(4.90)
Type -713
.183
(4.65)
.193
(4.90)
.030 Dia.
(0.76)
.018 Dia.
(0.46)
.125
(3.18)
.018 Dia.
(0.46)
.125
(3.18)
.030 Dia.
(0.76)
Terminals for BGA Device Test Applications
(Consult Factory for Availability)
Type -657
.183
(4.65)
Type -659
Type -709
.183
(4.65)
Specifications
Terminals:
Brass; Copper Alloy
(C36000)
Terminal Support:
Polyimide Film
Contacts:
Beryllium Copper (C17200)
Plating:
G – Gold over Nickel
Spring Material:
Stainless Steel
Heat Sink/Coin Screw and Support Plate
Material:
Aluminum
Insulator, Lid and Latch Material:
.018 Dia.
(0.46)
.125
(3.18)
.030 Dia.
(0.76)
.183
(4.65)
.016 Dia.
(0.41)
.125
(3.18)
How To Order
X
Footprint Dash #
If Applicable*
Flip-Top™
BGA Socket
Pitch
G = .050/(1.27mm) pitch
Number of Positions
*See BGA Footprint Booklet
or web site
Terminal Type
See options above
FT G XXXX - 690 G G XX
Clamp Options
HS - Heat Sink (3 Fins Std.)
CS - Coin Screw
Contact Plating
G - Gold
Terminal Plating
G - Gold
Molded PPS (High Temp. Glass Filled
Thermoplastic), U.L. Rated 94V-O,
-60°C to 260°C (-76°F to 500°F)
Solder Ball:
Eutectic, 63Sn/37Pb,183°C (361°F)
FT-TECH02
REV. 3/02
Mechanical specifications for BGA device package required for quoting/ordering.
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:
inch/(mm).

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