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In measuring power supply noise, we face various challenges, including RF interference and signal-to-noise ratio (SNR). Next, let's look at how to achieve high bandwidth in the measurement while mini...[Details]
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Recently, Professor Li Baojun and Professor Xin Hongbao from the Institute of Nanophotonics of Jinan University have made important progress in the field of light-controlled micro-nanobiological
...[Details]
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TE Connectivity's Industry Technology Index Annual Report: China's market optimism about AI technology and commitment to sustainable development are among the highest in the world
SC...[Details]
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USB-IF launched the USB3.0 specification in November 2008. The technology was jointly developed by the USB3.0 promotion group composed of Intel, Microsoft, HP, NEC, NXP Semiconductors, TI a...[Details]
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News Highlights
The first NI rugged rack-mount controller and new PXI Express remote controllers have high-speed data read and write performance, expanding the PXI platform’s PC control capabilit...[Details]
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There are usually several ways to exchange information between the microcontroller CPU and external devices: unconditional transmission, query transmission and interrupt transmission. We use the inte...[Details]
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Power
line communication technology is developing very rapidly and has now entered the initial application stage. The PLC system makes full use of
the extensive line resources of
the power...[Details]
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Data encryption is to ensure the security of the transmitted information by artificially disturbing the original data according to a certain rule under the control of specific parameters (called ke...[Details]
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TSMC achieved its highest revenue in history last year, overtaking Samsung to become the global semiconductor leader. Faced with the market digesting inventory in the first half of this year, the cos...[Details]
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At MODEX 2024, Schneider Electric announced the release of two new
collaborative robots
: Lexium RL 3 and RL 12, and the Lexium RL 18 model later this year. From single-axis machine tools t...[Details]
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I. Overview IIC stands for Inter-Integrated Circuit (IC bus). This bus type was designed by Philips Semiconductor in the early 1980s. It is a simple, bidirectional, two-wire, synchronous se...[Details]
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Thin-film solar panels set 14% efficiency record
CIGSfab achieves maximum efficiency in mass production
Manz and its R&D partner ZSW set a laboratory record of 20.3% efficiency
Manz ...[Details]
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The first 5G autonomous driving open road scene demonstration operation base in China was opened in Chongqing Xiantao International Big Data Valley. According to reports, Xiantao International Big Da...[Details]
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1. Detailed explanation of SPI subsystem block diagram:
There are two types of devices on the SPI bus: one is the master end, which usually appears as a submodule of the SOC system. For exampl...[Details]
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Digital blogger @数码闲聊站 talked about the topic of foldable screen phones during a chat today. Then a netizen asked about Xiaomi's next generation of foldable screen phones. He said that we still need ...[Details]