Tpli
TM
200 Series
Innovative
Technology
for a
Connected
World
Gap Filler
ExcEpTionally SofT, highly coMprESSiblE gap fillEr
Tpli™ 200 is a premium gap filler. A unique blend of boron nitride and silicone
produce the highest performing interface pad.
Tpli™ 200’s exceptional combination of high thermal conductivity and compliancy
generate unmatched thermal resistances in a gap filling interface material.
Tpli™ 200 absorbs shock and relieves stresses, thus minimizing potential damage to
components. Tpli™ 200 is electrically insulating, stable from -45°C to 200°C, and
meets UL 94 HB rating.
fEaTUrES anD bEnEfiTS
• Thermal performance leader
• 6 W/mK thermal conductivity
• Soft and compliant
• Available in thicknesses from
0.010” - 0.200” (0.25mm - 5.0mm)
applicaTionS
• Notebook computers
• Handheld portable electronics
• Micro heat pipe thermal solutions
• Micro processors, memory chips,
and graphic processors
• Automotive engine control modules
• Wireless communication hardware
global
solutions:
local
support
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
Tpli
TM
200 Series
Gap Filler
Innovative
Technology
for a
Connected
World
TpLI™ 210
Construction &
Composition
Color
Thickness
Thickness Tolerance
Density
Hardness
Tensile Strength
% elongation
Outgassing TML
(post Cured)
Outgassing CVCM
(post Cured)
UL Flammability Rating
Temperature Range
Thermal Conductivity
Thermal Impedance
@ 20 psi @ 138Kpa
Thermal expansion
Breakdown Voltage
Volume Resistivity
Dielectric Constant
@ 1MHz
0.010” (0.25mm)
0.030” (0.76mm)
0.070” (1.78mm)
0.110” (2.79mm)
0.150” (3.81mm)
0.190” (4.83mm)
TpLI™ 220
Boron nitride filled
silicone elastomer
Blue
0.020” (0.51mm)
± 0.002”
(± 0.05mm)
1.43 g/cc
70 Shore OO
35 psi
5
0.07%
0.02%
94 HB
-45°C to 200°C
6 W/mK
0.21°C - in
2
/W
1.35°C - cm
2
/W
123 ppm/C
4,000 Volts AC
5 x 10
13
ohm-cm
3.21
TpLI™ 240
Boron nitride filled
silicone elastomer
Yellow
0.040” (1.02mm)
± 0.003”
(± 0.08mm)
1.43 g/cc
70 Shore OO
35 psi
5
0.07%
0.02%
94 HB
-45°C to 200°C
6 W/mK
0.37°C - in
2
/W
2.45°C - cm
2
/W
72 ppm/C
>5,000 Volts AC
5 x 10
13
ohm-cm
3.26
TpLI™ 260
Boron nitride filled
silicone elastomer
Grey
0.060” (1.52mm)
± 0.004”
(± 0.10mm)
1.38 g/cc
70 Shore OO
20 psi
5
0.10%
0.04%
94 HB
-45°C to 200°C
6 W/mK
0.49°C - in
2
/W
3.35°C - cm
2
/W
72 ppm/C
>5,000 Volts AC
5 x 10
13
ohm-cm
3.26
TpLI™ 2100
Boron nitride filled
silicone elastomer
Grey
0.100” (2.54mm)
± 0.007”
(± 0.18mm)
1.36 g/cc
70 Shore OO
15 psi
5
0.15%
0.07%
94 HB
-45°C to 200°C
6 W/mK
0.84°C - in
2
/W
5.81°C - cm
2
/W
96 ppm/C
>5,000 Volts AC
5 x 10
13
ohm-cm
3.4
TeST MeTHOD
Reinforced boron nitride
filled silicone elastomer
Rose
0.010” (0.25mm)
± 0.001”
(± 0.025mm)
1.44 g/cc
75 Shore OO
N/A
N/A
0.08%
0.03%
94 HB
-45°C to 200°C
6 W/mK
0.16°C - in
2
/W
1.03°C - cm
2
/W
51 ppm/C
1,000 Volts AC
5 x 10
13
ohm-cm
3.21
Visual
Helium
pycnometer
ASTM D2240
ASTM D412
ASTM D412
ASTM e595
ASTM e595
e180840
ASTM D5470
(modified)
ASTM D5470
(modified)
IpC-TM-650
2.4.24
ASTM D149
ASTM D257
ASTM D150
STanDarD ThicknESSES
0.015” (0.38mm)
0.040” (1.02mm)
0.080” (2.03mm)
0.120” (3.05mm)
0.160” (4.06mm)
0.200” (5.08mm)
0.020” (0.51mm)
0.025” (0.64mm)
0.050” (1.27mm)
0.060” (1.52mm)
0.090” (2.29mm)
0.100” (2.54mm)
0.130” (3.30mm)
0.140” (3.56mm)
0.170” (4.32mm)
0.180” (4.57mm)
Consult the factory for alternate thicknesses.
prESSUrE SEnSiTivE aDhESivE
Request no adhesive with”AO” suffix. Request adhesive on one side with “A1” suffix.
Double sided adhesive is not available
rEinforcEMEnT
STanDarD ShEET SizES
Fiberglass is required in thicknesses of 0.010” (0.25mm) and 0.015” (0.38mm).
Reinforcement is optional in thicknesses 0.020” (0.5mm) and 0.025” (0.63mm).
Indicate fiberglass by “FG” suffix. Thicknesses above 0.025” (0.063mm) are
not reinforced.
Data for design engineer guidance only. Observed performance varies in application.
engineers are reminded to test the material in application.
8” x 8” (203mm x 203 mm) & 16” x 16” (406mm x 406mm). Tpli™ 200 may be die cut
into individual shapes.
THR-DS-Tpli-200 0710
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and ap-
plication of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,
merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All
Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird
Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
A13519-00 Rev G, 2/05/07
Microcontroller MCU
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